Inventor
KNICKERBOCKER JOHN ULRICH
US40 patents
⚠️ This page may combine multiple inventors who share the name “KNICKERBOCKER JOHN ULRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US8008764B2Aug 30, 2011
Bridges for interconnecting interposers in multi-chip integrated circuits
IBM42 citations95
US7808798B2Oct 5, 2010
Versatile Si-based packaging with integrated passive components for mmWave applications
IBM27 citations92
US7750459B2Jul 6, 2010
Integrated module for data processing system
IBM29 citations92
US7518229B2Apr 14, 2009
Versatile Si-based packaging with integrated passive components for mmWave applications
IBM31 citations92
US7486525B2Feb 3, 2009
Temporary chip attach carrier
IBM17 citations92
US5783026AJul 21, 1998
Apparatus for stacking sheets by carriers
IBM42 citations91
US7863189B2Jan 4, 2011
Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density
IBM32 citations90
US8581392B2Nov 12, 2013
Silicon based microchannel cooling and electrical package
IBM8 citations84
US7902069B2Mar 8, 2011
Small area, robust silicon via structure and process
IBM6 citations74
US5986395ANov 16, 1999
Metal/ferrite laminate magnet
IBM6 citations74
US5665195ASep 9, 1997
Apparatus for forming cavities without using an insert
IBM8 citations74
US7741153B2Jun 22, 2010
Modular chip integration techniques
IBM7 citations73
US5707476AJan 13, 1998
Method for forming multiple cavity products
IBM8 citations71
US5876549AMar 2, 1999
Method and apparatus for stacking sheets supported by carriers
IBM10 citations69
US5759669AJun 2, 1998
Apparatus and method for screening green sheet with via hole using porous backing material
IBM14 citations69
US8354737B2Jan 15, 2013
Small area, robust silicon via structure and process
IBM2 citations63
US7713575B2May 11, 2010
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
IBM4 citations63
US7514290B1Apr 7, 2009
Chip-to-wafer integration technology for three-dimensional chip stacking
IBM3 citations63
US6264885B1Jul 24, 2001
Metal/ferrite laminate magnet
IBM2 citations63
US5772837AJun 30, 1998
Apparatus for forming cavities without using an insert
IBM3 citations63
US7892885B2Feb 22, 2011
Techniques for modular chip fabrication
IBM2 citations62
US7282391B1Oct 16, 2007
Method for precision assembly of integrated circuit chip packages
IBM5 citations62
US6376054B1Apr 23, 2002
Surface metallization structure for multiple chip test and burn-in
IBM5 citations61
US5707480AJan 13, 1998
Apparatus for forming multiple cavity products
IBM5 citations60
US5891543AApr 6, 1999
Apparatus and method for screening using electrostatic adhesion
IBM3 citations58
US7504718B2Mar 17, 2009
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
IBM6 citations57
US7615405B2Nov 10, 2009
Method for precision assembly of integrated circuit chip packages
IBM0 citations52
US6376983B1Apr 23, 2002
Etched and formed extractor grid
IBM1 citations51
KNICKERBOCKER JOHN ULRICH
3 patentsUS8213184B2Jul 3, 2012
Method of testing using a temporary chip attach carrier
KNICKERBOCKER JOHN ULRICH107 citations97
US8110415B2Feb 7, 2012
Silicon based microchannel cooling and electrical package
KNICKERBOCKER JOHN ULRICH38 citations95
US8421220B2Apr 16, 2013
Silicon based microchannel cooling and electrical package
KNICKERBOCKER JOHN ULRICH4 citations61
CARON ALAIN
2 patentsHAMEL HARVEY
2 patentsUS8310259B2Nov 13, 2012
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
HAMEL HARVEY12 citations78
US9159616B2Oct 13, 2015
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
HAMEL HARVEY1 citations46