Inventor
TSANG CORNELIA KANG-I
US24 patents
⚠️ This page may combine multiple inventors who share the name “TSANG CORNELIA KANG-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS9472859B2Oct 18, 2016
Integration of area efficient antennas for phased array or wafer scale array antenna applications
IBM16 citations92
US7808798B2Oct 5, 2010
Versatile Si-based packaging with integrated passive components for mmWave applications
IBM27 citations92
US7750459B2Jul 6, 2010
Integrated module for data processing system
IBM29 citations92
US7518229B2Apr 14, 2009
Versatile Si-based packaging with integrated passive components for mmWave applications
IBM31 citations92
US7060624B2Jun 13, 2006
Deep filled vias
IBM28 citations91
US10381255B2Aug 13, 2019
Double layer release temporary bond and debond processes and systems
IBM7 citations84
US10297479B2May 21, 2019
Wafer debonding using mid-wavelength infrared radiation ablation
IBM8 citations84
US10224229B2Mar 5, 2019
Double layer release temporary bond and debond processes and systems
IBM8 citations84
US9636782B2May 2, 2017
Wafer debonding using mid-wavelength infrared radiation ablation
IBM6 citations84
US7678696B2Mar 16, 2010
Method of making through wafer vias
IBM16 citations84
US10103450B2Oct 16, 2018
Integration of area efficient antennas for phased array or wafer scale array antenna applications
IBM7 citations83
US11424152B2Aug 23, 2022
Handler bonding and debonding for semiconductor dies
IBM0 citations62
US7987591B2Aug 2, 2011
Method of forming silicon chicklet pedestal
IBM1 citations62
US7741722B2Jun 22, 2010
Through-wafer vias
IBM5 citations62
US9897627B2Feb 20, 2018
Test probe substrate
IBM0 citations52
US9851379B2Dec 26, 2017
Test probe substrate
IBM0 citations52
US9606142B2Mar 28, 2017
Test probe substrate
IBM0 citations52