P

Inventor

AHN HEUI GYUN

KR15 patents
⚠️ This page may combine multiple inventors who share the name “AHN HEUI GYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONFILE TECH INC

4 patents
US9613881B2Apr 4, 2017

Semiconductor device having improved heat-dissipation characteristics

SILICONFILE TECH INC14 citations80
US9406652B2Aug 2, 2016

Stack memory

SILICONFILE TECH INC6 citations71
US9478464B2Oct 25, 2016

Method for manufacturing through-hole silicon via

SILICONFILE TECH INC1 citations50
US9543348B2Jan 10, 2017

Backlight image sensor chip having improved chip driving performance

SILICONFILE TECH INC0 citations38

JEON IN GYUN

2 patents
US8421134B2Apr 16, 2013

Back side illumination image sensor reduced in size and method for manufacturing the same

JEON IN GYUN7 citations80
US8420429B2Apr 16, 2013

Back side illumination image sensor reduced in size and method for manufacturing the same

JEON IN GYUN1 citations48

SILICONFILE TECHNOLOGIES INC

2 patents
US8993411B2Mar 31, 2015

Method for forming pad in wafer with three-dimensional stacking structure

SILICONFILE TECHNOLOGIES INC0 citations50
US8368158B2Feb 5, 2013

Image sensor having wave guide and method for manufacturing the same

SILICONFILE TECHNOLOGIES INC0 citations50

DONGBU ELECTRONICS CO LTD

2 patents
US7772666B2Aug 10, 2010

CMOS image sensor and method for manufacturing the same

DONGBU ELECTRONICS CO LTD0 citations50
US7247533B2Jul 24, 2007

Method of fabricating semiconductor device using selective epitaxial growth

DONGBU ELECTRONICS CO LTD0 citations50

SK HYNIX INC

2 patents
US10165169B2Dec 25, 2018

Image processing package and camera module having same

SK HYNIX INC1 citations49
US10313620B2Jun 4, 2019

Image data output device for image signal processor

SK HYNIX INC0 citations39

AHN HEUI-GYUN

1 patent
US8193023B2Jun 5, 2012

Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same

AHN HEUI-GYUN9 citations80

JEON IN-GYUN

1 patent
US8816459B2Aug 26, 2014

Image sensor having wave guide and method for manufacturing the same

JEON IN-GYUN0 citations48

AHN HEUI GYUN

1 patent
US8399282B2Mar 19, 2013

Method for forming pad in wafer with three-dimensional stacking structure

AHN HEUI GYUN1 citations48