Inventor

WEI KUO-HSIU

TW23 patents

⚠️ This page may combine multiple inventors who share the name “WEI KUO-HSIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WEI KUO-HSIU

TAIWAN SEMICONDUCTOR MFG CO LTD

Wafer edge trimming tool using abrasive tape

Methods of forming an abrasive slurry and methods for chemical- mechanical polishing

Metal loss prevention using implantation

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Metal loss prevention using implantation

Metal loss prevention using implantation

Metal loss prevention using implantation

Methods of forming an abrasive slurry and methods for chemical-mechanical polishing

Wafer thinning apparatus having feedback control

Structure and formation method of semiconductor device with conductive feature

Structure and formation method of semiconductor device with conductive feature

Method for wafer grinding

Lithography tool with backside polisher

TAIWAN SEMICONDUCTOR MFG

Removal of SiON residue after CMP

Method and system for slurry usage reduction in chemical mechanical polishing

Wafer polishing tool using abrasive tape

Feature dimension measurement

KUO CHUN-TING

Methods for minimizing edge peeling in the manufacturing of BSI chips

Wafer edge trim blade with slots

Modular grinding apparatuses and methods for wafer thinning

CHEN YUAN HSUAN

Wafer thinning apparatus having feedback control and method of using

WEI KUO-HSIU

Apparatus for wafer grinding

CHENG MU-HAN

Image sensor manufacturing methods