Inventor

CHIRAS STEFANIE R

US11 patents

⚠️ This page may combine multiple inventors who share the name “CHIRAS STEFANIE R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

9 patents

US7402532B2Jul 22, 2008

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

IBM28 citations92

US7119018B2Oct 10, 2006

Copper conductor

IBM20 citations92

US7102232B2Sep 5, 2006

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

IBM19 citations92

US8023345B2Sep 20, 2011

Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer

IBM4 citations72

US7495338B2Feb 24, 2009

Metal capped copper interconnect

IBM4 citations63

LASTRAS-MONTANO LUIS A

1 patent

US8166368B2Apr 24, 2012

Writing a special symbol to a memory to indicate the absence of a data signal

LASTRAS-MONTANO LUIS A4 citations62

BREITWISCH MATTHEW J

1 patent

US8897062B2Nov 25, 2014

Memory programming for a phase change memory cell

BREITWISCH MATTHEW J1 citations52

CHIRAS STEFANIE R

IBM

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

Copper conductor

Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer

Iteratively writing contents to memory locations using a statistical model

Electroplated CoWP composite structures as copper barrier layers

Electroplated CoWP composite structures as copper barrier layers

Asynchronous persistent stores for transactions

Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer

Metal capped copper interconnect

LASTRAS-MONTANO LUIS A

Writing a special symbol to a memory to indicate the absence of a data signal

BREITWISCH MATTHEW J

Memory programming for a phase change memory cell