Inventor
MINAMIO MASANORI
JP109 patents
⚠️ This page may combine multiple inventors who share the name “MINAMIO MASANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
28 patentsUS6897428B2May 24, 2005
Solid-state imaging device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD70 citations98
US6642609B1Nov 4, 2003
Leadframe for a semiconductor device having leads with land electrodes
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD106 citations98
US6710430B2Mar 23, 2004
Resin-encapsulated semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD85 citations97
US6674154B2Jan 6, 2004
Lead frame with multiple rows of external terminals
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD104 citations97
US6638790B2Oct 28, 2003
Leadframe and method for manufacturing resin-molded semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD69 citations96
US6338984B2Jan 15, 2002
Resin-molded semiconductor device, method for manufacturing the same, and leadframe
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD54 citations94
US7405104B2Jul 29, 2008
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD26 citations92
US7273765B2Sep 25, 2007
Solid-state imaging device and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD28 citations92
US7049684B2May 23, 2006
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD25 citations92
US7042071B2May 9, 2006
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US7026192B2Apr 11, 2006
Terminal land frame and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6909168B2Jun 21, 2005
Resin encapsulation semiconductor device utilizing grooved leads and die pad
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations92
US6692991B2Feb 17, 2004
Resin-encapsulated semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6680220B2Jan 20, 2004
Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD32 citations92
US6680524B2Jan 20, 2004
Semiconductor device and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations92
US6667541B1Dec 23, 2003
Terminal land frame and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US7247509B2Jul 24, 2007
Method for manufacturing solid-state imaging devices
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD24 citations91
US6900524B1May 31, 2005
Resin molded semiconductor device on a lead frame and method of manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations91
US6984880B2Jan 10, 2006
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD34 citations90
US6720207B2Apr 13, 2004
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations90
US7378748B2May 27, 2008
Solid-state imaging device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD14 citations84
US7265340B2Sep 4, 2007
Optical device and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations83
US7132315B2Nov 7, 2006
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations83
US7166908B2Jan 23, 2007
Optical device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations82
US7126209B2Oct 24, 2006
Lead frame, resin-encapsulated semiconductor device, and method of producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations82
USD501664SFeb 8, 2005
Image sensor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations80
US7367120B2May 6, 2008
Method for producing a solid-state imaging device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations73
US7294907B2Nov 13, 2007
Solid-state imaging device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73
PANASONIC CORP
9 patentsUS7495319B2Feb 24, 2009
Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
PANASONIC CORP59 citations98
US7939901B2May 10, 2011
Optical device for reducing disturbance light and manufacturing method thereof
PANASONIC CORP21 citations92
US7822090B2Oct 26, 2010
Semiconductor device
PANASONIC CORP12 citations84
US7755030B2Jul 13, 2010
Optical device including a wiring having a reentrant cavity
PANASONIC CORP12 citations84
US7582944B2Sep 1, 2009
Optical apparatus and optical module using the same
PANASONIC CORP13 citations84
US7528884B2May 5, 2009
Optical device
PANASONIC CORP10 citations84
US7834926B2Nov 16, 2010
Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor
PANASONIC CORP11 citations83
US9136193B2Sep 15, 2015
Semiconductor device and method of manufacturing the same
PANASONIC CORP8 citations81
US7485848B2Feb 3, 2009
Optical device and production method thereof
PANASONIC CORP5 citations74
MATSUSHITA ELECTRONICS CORP
6 patentsUS6225146B1May 1, 2001
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP247 citations99
US5977615ANov 2, 1999
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP159 citations99
US6130115AOct 10, 2000
Plastic encapsulated semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRONICS CORP210 citations98
US5942794AAug 24, 1999
Plastic encapsulated semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRONICS CORP230 citations98
US6208020B1Mar 27, 2001
Leadframe for use in manufacturing a resin-molded semiconductor device
MATSUSHITA ELECTRONICS CORP362 citations97
US5708295AJan 13, 1998
Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRONICS CORP10 citations74
MINAMIO MASANORI
2 patentsMATSUSHITA ELECRTRIC IND CO LT
1 patentMATSUSHIA ELECTRIC IND CO LTD
1 patentPANASONIIC CORP
1 patentKAWAI FUMIHIKO
1 patentPANASONIC IP MAN CO LTD
1 patentShowing the top 50 of 109 patents by PatentIndex Score.