Inventor

FUKUDA TOSHIYUKI

JP83 patents

⚠️ This page may combine multiple inventors who share the name “FUKUDA TOSHIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKUDA TOSHIYUKI

PANASONIC CORP

Semiconductor device and manufacturing method thereof

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Stacked semiconductor module

Semiconductor device

Semiconductor device

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

Semiconductor device

Multilevel semiconductor module and method for fabricating the same

Optical apparatus and optical module using the same

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor

Semiconductor device having recessed connector portions

Light-emitting device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Electronic component module and an assembly including the same

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Stacked semiconductor module

Optical device, optical device apparatus, camera module, and optical device manufacturing method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Multi-level semiconductor module and method for fabricating the same

Solid-state imaging device and method for manufacturing the same

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Semiconductor device

Semiconductor device and method for fabricating the same

Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package

Stacked semiconductor device

Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device

Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device

Imaging module and method for forming the same

Semiconductor device and manufacturing method for the same

Optical device

Semiconductor device

Multi-level semiconductor module

Semiconductor device

Semiconductor wafer and testing method therefor

SANDEN CORP

Refrigerated display cabinet

Method for controlling the defrosting of refrigerator-freezer units of varying degrees of frost accumulation

Method for controlling the defrosting of refrigerator-freezer units of varying degrees of frost accumulation

MATSUSHITA ELECTRONICS CORP

Plastic encapsulated semiconductor device and method of manufacturing the same

Plastic encapsulated semiconductor device and method of manufacturing the same

KANZAKI KOKYUKOKI MFG CO LTD

Transaxle

Transaxle

SHIMIZU YOSHIAKI

Semiconductor device and method of manufacturing the same

ITOU KENICHI

Semiconductor device

KAWABATA TAKESHI

Stacked semiconductor module

PANASONIIC CORP

Wiring board and semiconductor device

KAWAI FUMIHIKO

Resin encapsulated semiconductor device and method for manufacturing the same