Inventor
CHANG TIEN-CHANG
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHANG TIEN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
7 patentsUS7667302B1Feb 23, 2010
Integrated circuit chip with seal ring structure
MEDIATEK INC23 citations92
US7671469B2Mar 2, 2010
SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect
MEDIATEK INC16 citations82
US9847294B2Dec 19, 2017
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
US9627336B2Apr 18, 2017
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
US9455226B2Sep 27, 2016
Semiconductor device allowing metal layer routing formed directly under metal pad
MEDIATEK INC0 citations52
US8766417B2Jul 1, 2014
Integrated circuit chip with reduced IR drop
MEDIATEK INC0 citations51
US11854924B2Dec 26, 2023
Semiconductor package with improved reliability
MEDIATEK INC0 citations50
CHANG TIEN-CHANG
4 patentsUS8242586B2Aug 14, 2012
Integrated circuit chip with seal ring structure
CHANG TIEN-CHANG12 citations82
US8138616B2Mar 20, 2012
Bond pad structure
CHANG TIEN-CHANG12 citations82
US8587090B2Nov 19, 2013
Die seal ring structure
CHANG TIEN-CHANG1 citations50
US8669619B2Mar 11, 2014
Semiconductor structure with multi-layer contact etch stop layer structure
CHANG TIEN-CHANG1 citations44