Inventor
PARK CHANG JUN
KR25 patents
⚠️ This page may combine multiple inventors who share the name “PARK CHANG JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
9 patentsUS7795139B2Sep 14, 2010
Method for manufacturing semiconductor package
HYNIX SEMICONDUCTOR INC47 citations94
US7898834B2Mar 1, 2011
Semiconductor chip with chip selection structure and stacked semiconductor package having the same
HYNIX SEMICONDUCTOR INC18 citations92
US8358016B2Jan 22, 2013
Semiconductor package having an internal cooling system
HYNIX SEMICONDUCTOR INC5 citations84
US8044516B2Oct 25, 2011
Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same
HYNIX SEMICONDUCTOR INC7 citations84
US7795073B2Sep 14, 2010
Method for manufacturing stack package using through-electrodes
HYNIX SEMICONDUCTOR INC12 citations84
US7446405B2Nov 4, 2008
Wafer level chip scale package (WLCSP) with high reliability against thermal stress
HYNIX SEMICONDUCTOR INC9 citations84
US7989264B2Aug 2, 2011
Warpage resistant semiconductor package and method for manufacturing the same
HYNIX SEMICONDUCTOR INC3 citations62
US7795718B2Sep 14, 2010
Warpage resistant semiconductor package and method for manufacturing the same
HYNIX SEMICONDUCTOR INC3 citations62
US7859102B2Dec 28, 2010
Multi-layer stacked wafer level semiconductor package module
HYNIX SEMICONDUCTOR INC1 citations52
HYUNDAI MOTOR CO LTD
4 patentsUS9163593B2Oct 20, 2015
Fuel heating device for improving cold start performance of flex fuel vehicle
HYUNDAI MOTOR CO LTD2 citations62
US11479112B2Oct 25, 2022
Fuel tank venting system for hybrid vehicle
HYUNDAI MOTOR CO LTD0 citations59
US9273645B2Mar 1, 2016
Fluid heating device and vehicle fuel system using the same
HYUNDAI MOTOR CO LTD0 citations52
US9982623B2May 29, 2018
Apparatus and method for preventing overflow of fuel from vehicle fuel tank
HYUNDAI MOTOR CO LTD1 citations48
HYUNDAI ELECTRONICS IND
3 patentsUS6316825B1Nov 13, 2001
Chip stack package utilizing a connecting hole to improve electrical connection between leadframes
HYUNDAI ELECTRONICS IND112 citations96
US6297543B1Oct 2, 2001
Chip scale package
HYUNDAI ELECTRONICS IND74 citations95
US6677181B2Jan 13, 2004
Method for fabricating stacked chip package device
HYUNDAI ELECTRONICS IND16 citations91
PARK CHANG JUN
3 patentsUS8643466B2Feb 4, 2014
Method and system for setting security of a portable terminal
PARK CHANG JUN2 citations53
US8394717B2Mar 12, 2013
Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same
PARK CHANG JUN0 citations49
US8338921B2Dec 25, 2012
Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same
PARK CHANG JUN0 citations49