Inventor

LIN YIZHEN

US47 patents

⚠️ This page may combine multiple inventors who share the name “LIN YIZHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN YIZHEN

FREESCALE SEMICONDUCTOR INC

Angular rate sensor having multiple axis sensing capability

Transducer with decoupled sensing in mutually orthogonal directions

Differential capacitive sensor and method of making same

Symmetrical differential capacitive sensor and method of making same

Multiple axis rate sensor

Stiction resistant mems device and method of operation

Angular rate sensor with quadrature error compensation

Pressure sensor with differential capacitive output

MEMS device having variable gap width and method of manufacture

MEMS pressure transducer assembly

Inertial sensor and method of levitation effect compensation

LIN YIZHEN

Vertically integrated MEMS acceleration transducer

MEMS sensor device with multi-stimulus sensing

Method of producing a microelectromechanical (MEMS) sensor device

Capacitive sensor with stress relief that compensates for package stress

MEMS pressure sensor device and method of fabricating same

Angular rate sensor with quadrature error compensation

MEMS device with central anchor for stress isolation

Sensor device and related fabrication methods

Rotary disk gyroscope

Microelectromechanical systems devices and methods for the fabrication thereof

GEN ELECTRIC

Insertion apparatus including rigidizable body

Downhole dynamometer and method of operation

Multimodal probe array

Resonant opto-mechanical accelerometer for use in navigation grade environments

Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing

Inertial sensing systems and methods of manufacturing the same

Inertial sensing systems and methods of manufacturing the same

Systems and methods for X-ray imaging

System and method of electrostatic carouseling for gyrocompassing

Electromechanical system substrate attachment for reduced thermal deformation

MCNEIL ANDREW C

Laterally integrated MEMS sensor device with multi-stimulus sensing

Resonant accelerometer with low sensitivity to package stress

MEMS sensor with stress isolation and method of fabrication

Pressure sensor with differential capacitive output

MEMS device having variable gap width and method of manufacture

SCHLARMANN MARK E

MEMS device assembly and method of packaging same

MEMS pressure transducer assembly and method of packaging same

ETENNA CORP

Method of manufacturing antennas using micro-insert-molding techniques

MILLER TODD F

Vertically integrated MEMS sensor device with multi-stimulus sensing

ACTIONTEC ELECTRONICS INC

Multiband antenna with parasitically-coupled resonators

GEISBERGER AARON A

Accelerometer with over-travel stop structure

JIA KEMAIO

Fully decoupled lateral axis gyroscope with thickness-insensitive Z-axis spring and symmetric teeter totter sensing element

DAWSON CHAD S

Multi-chip device with temperature control element for temperature calibration

LORECK HEINZ

Vibration robust x-axis ring gyro transducer

LI GARY G

Inertial sensor with off-axis spring system

AMPHENOL CORP

Systems and methods for hybrid flow sensing