Inventor

GONG YUPING

CN21 patents

⚠️ This page may combine multiple inventors who share the name “GONG YUPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GONG YUPING

GONG YUPING

Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET

Semiconductor wafer level package (WLP) and method of manufacture thereof

Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method

Chip-exposed semiconductor device and its packaging method

Wafer level chip scale package method using clip array

Thin power device and preparation method thereof

Double-side exposed semiconductor device and its manufacturing method

ALPHA & OMEGA SEMICONDUCTOR

Chip-exposed semiconductor device

Method for preparing semiconductor devices applied in flip chip technology

Substrateless power device packages

XUE YAN XUN

Packaging method of molded wafer level chip scale package (WLCSP)

Packaging method of molded wafer level chip scale package (WLCSP)

SHI LEI

Power semiconductor device package method

Flip-chip semiconductor chip packing method

ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD

Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof

Preparation method of a thin power device

HUANG PING

Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip

YILMAZ HAMZA

Stacked multi-chip bottom source semiconductor device and preparation method thereof

FENG TAO

Substrateless power device packages

ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD

Double-side exposed semiconductor device

HUAWEI TECH CO LTD

System in package module assembly, system in package module, and electronic device