Inventor
CHAN MU-HSUAN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHAN MU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
12 patentsUS9899303B2Feb 20, 2018
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US8952537B2Feb 10, 2015
Conductive bump structure with a plurality of metal layers
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations60
US10403567B2Sep 3, 2019
Fabrication method of electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9768140B2Sep 19, 2017
Method for fabricating package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9607941B2Mar 28, 2017
Conductive via structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9349705B2May 24, 2016
Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9418874B2Aug 16, 2016
Method of fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9087780B2Jul 21, 2015
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US8829687B2Sep 9, 2014
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9754898B2Sep 5, 2017
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9515040B2Dec 6, 2016
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9337061B2May 10, 2016
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations38