Inventor
HWANG JAMES JENG-JYI
TW13 patents
⚠️ This page may combine multiple inventors who share the name “HWANG JAMES JENG-JYI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS10065288B2Sep 4, 2018
Chemical mechanical polishing (CMP) platform for local profile control
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations82
US11287745B2Mar 29, 2022
Reticle-masking structure, extreme ultraviolet apparatus, and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10875148B2Dec 29, 2020
Apparatus and methods for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10866519B1Dec 15, 2020
Reticle-masking structure, extreme ultraviolet apparatus, and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10513006B2Dec 24, 2019
High throughput CMP platform
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US12066760B2Aug 20, 2024
Reticle-masking structure, extreme ultra violet apparatus, and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11999027B2Jun 4, 2024
Method for polishing semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11772227B2Oct 3, 2023
Device and methods for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11602821B2Mar 14, 2023
Wafer polishing head, system thereof, and method using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10875143B2Dec 29, 2020
Apparatus and methods for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations40
US10507498B2Dec 17, 2019
Apparatus for particle cleaning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39