Inventor

LEE BO-I

TW20 patents

⚠️ This page may combine multiple inventors who share the name “LEE BO-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE BO-I

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package including a substrate with a stepped sidewall structure

Method of forming wafer-level molded structure for package assembly

Apparatus and method for chemically mechanically polishing

Method of planarizing a wafer

Method of manufacturing semiconductor device by applying molding layer in substrate groove

Through silicon via bonding structure

Method of manufacturing semiconductor package including forming a recessed region in a substrate

TAIWAN SEMICONDUCTOR MFG

Bonding metallurgy for three-dimensional interconnect

Method for producing stackable dies

Method of forming wafer-level molded structure for package assembly

LEE BO-I

Delamination resistance of stacked dies in die saw

Bonding metallurgy for three-dimensional interconnect

Manufacture and method of making the same

WANG TSUNG-DING

Semiconductor package having a recess filled with a molding compound

Wafer-level molded structure for package assembly

HSIAO C W

Method of forming stacked-die packages

LEE BO I

Method and apparatus for performing a polishing process in semiconductor fabrication

WANG DEAN

Through silicon via bonding structure

HWANG JAMES JENG-JYI

Methods for real-time error detection in CMP processing

WU JIANN LIH

CMP pad cleaning apparatus