Inventor
THAMBIDURAI KARTHIK
US11 patents
⚠️ This page may combine multiple inventors who share the name “THAMBIDURAI KARTHIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MAXIM INTEGRATED PRODUCTS
9 patentsUS9324687B1Apr 26, 2016
Wafer-level passive device integration
MAXIM INTEGRATED PRODUCTS26 citations93
US9721912B2Aug 1, 2017
Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality
MAXIM INTEGRATED PRODUCTS10 citations82
US9040408B1May 26, 2015
Techniques for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS12 citations78
US10304758B1May 28, 2019
Wafer level package device formed using a wafer level lead frame on a carrier wafer having a similar coefficient of thermal expansion as an active wafer
MAXIM INTEGRATED PRODUCTS1 citations60
US8860222B2Oct 14, 2014
Techniques for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS2 citations59
US9806047B2Oct 31, 2017
Wafer level device and method with cantilever pillar structure
MAXIM INTEGRATED PRODUCTS1 citations51
US10032749B2Jul 24, 2018
Three-dimensional chip-to-wafer integration
MAXIM INTEGRATED PRODUCTS0 citations50
US9472451B2Oct 18, 2016
Technique for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS0 citations50
US9425064B2Aug 23, 2016
Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages
MAXIM INTEGRATED PRODUCTS0 citations41