P

Inventor

LIN SHIH-TING

TW79 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

33 patents
US10157888B1Dec 18, 2018

Integrated fan-out packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US9831224B2Nov 28, 2017

Solution for reducing poor contact in info packages

TAIWAN SEMICONDUCTOR MFG CO LTD17 citations93
US9412662B2Aug 9, 2016

Structure and approach to prevent thin wafer crack

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations93
US11355454B2Jun 7, 2022

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US10825693B2Nov 3, 2020

Carrier warpage control for three dimensional integrated circuit (3DIC) stacking

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10438934B1Oct 8, 2019

Package-on-package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10153179B2Dec 11, 2018

Carrier warpage control for three dimensional integrated circuit (3DIC) stacking

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9793187B2Oct 17, 2017

3D packages and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US9514988B1Dec 6, 2016

Semiconductor devices and packaging methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11469197B2Oct 11, 2022

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11462418B2Oct 4, 2022

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11056436B2Jul 6, 2021

Integrated fan-out structure with rugged interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10985140B2Apr 20, 2021

Structure and formation method of package structure with underfill

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10347612B2Jul 9, 2019

Solution for reducing poor contact in InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290513B2May 14, 2019

Carrier warpage control for three dimensional integrated circuit (3DIC) stacking

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9502271B2Nov 22, 2016

Warpage control for flexible substrates

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11948896B2Apr 2, 2024

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11769739B2Sep 26, 2023

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11476205B2Oct 18, 2022

Package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10923438B2Feb 16, 2021

Package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10867919B2Dec 15, 2020

Electronic device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12424576B2Sep 23, 2025

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12165978B2Dec 10, 2024

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11817410B2Nov 14, 2023

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11574872B2Feb 7, 2023

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11417606B2Aug 16, 2022

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11282793B2Mar 22, 2022

Integrated fan-out structure with rugged interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11205629B2Dec 21, 2021

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11101252B2Aug 24, 2021

Package-on-package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12519087B2Jan 6, 2026

Package structure with underfill

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400878B2Aug 26, 2025

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12142579B2Nov 12, 2024

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817425B2Nov 14, 2023

Package structure with underfill

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

NANYA TECHNOLOGY CORP

5 patents

IND TECH RES INST

3 patents

LIN JING-CHENG

2 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

HUANG CHAO TA

2 patents

HSU YU WEN

1 patent

TSAI TZONG-YOW

1 patent

HSU YU-WEN

1 patent

Showing the top 50 of 79 patents by PatentIndex Score.