Inventor
LIN SHIH-TING
TW79 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
33 patentsUS10157888B1Dec 18, 2018
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US9831224B2Nov 28, 2017
Solution for reducing poor contact in info packages
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations93
US9412662B2Aug 9, 2016
Structure and approach to prevent thin wafer crack
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations93
US11355454B2Jun 7, 2022
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US10825693B2Nov 3, 2020
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10438934B1Oct 8, 2019
Package-on-package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10153179B2Dec 11, 2018
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9793187B2Oct 17, 2017
3D packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US9514988B1Dec 6, 2016
Semiconductor devices and packaging methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11469197B2Oct 11, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11462418B2Oct 4, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11056436B2Jul 6, 2021
Integrated fan-out structure with rugged interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10985140B2Apr 20, 2021
Structure and formation method of package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10347612B2Jul 9, 2019
Solution for reducing poor contact in InFO package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290513B2May 14, 2019
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9502271B2Nov 22, 2016
Warpage control for flexible substrates
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11948896B2Apr 2, 2024
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11769739B2Sep 26, 2023
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11476205B2Oct 18, 2022
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10923438B2Feb 16, 2021
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10867919B2Dec 15, 2020
Electronic device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12424576B2Sep 23, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12165978B2Dec 10, 2024
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11817410B2Nov 14, 2023
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11574872B2Feb 7, 2023
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11417606B2Aug 16, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11282793B2Mar 22, 2022
Integrated fan-out structure with rugged interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11205629B2Dec 21, 2021
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11101252B2Aug 24, 2021
Package-on-package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12519087B2Jan 6, 2026
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400878B2Aug 26, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12142579B2Nov 12, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817425B2Nov 14, 2023
Package structure with underfill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
NANYA TECHNOLOGY CORP
5 patentsUS10566432B2Feb 18, 2020
Transistor device
NANYA TECHNOLOGY CORP2 citations73
US12292455B2May 6, 2025
Chip socket, testing fixture and chip testing method thereof
NANYA TECHNOLOGY CORP0 citations63
US12176874B2Dec 24, 2024
Signal receiving circuit and noise filtering method thereof
NANYA TECHNOLOGY CORP0 citations63
US12009022B2Jun 11, 2024
Semiconductor device for memory device
NANYA TECHNOLOGY CORP0 citations63
US11959939B2Apr 16, 2024
Chip socket, testing fixture and chip testing method thereof
NANYA TECHNOLOGY CORP0 citations63
IND TECH RES INST
3 patentsUS11543312B2Jan 3, 2023
Spindle shaft device with torque sensor
IND TECH RES INST2 citations73
US11411161B2Aug 9, 2022
Piezoelectric sensing system and piezoelectric sensing circuit
IND TECH RES INST2 citations68
US10203252B2Feb 12, 2019
Microelectromechanical apparatus having a measuring range selector
IND TECH RES INST1 citations62
LIN JING-CHENG
2 patentsTAIWAN SEMICONDUCTOR MFG
2 patentsHUANG CHAO TA
2 patentsUS9227841B2Jan 5, 2016
Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
HUANG CHAO TA5 citations72
US8809972B2Aug 19, 2014
Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
HUANG CHAO TA5 citations72
HSU YU WEN
1 patentTSAI TZONG-YOW
1 patentHSU YU-WEN
1 patentShowing the top 50 of 79 patents by PatentIndex Score.