P

Inventor

HAUTALA JOHN J

US49 patents
⚠️ This page may combine multiple inventors who share the name “HAUTALA JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEL EPION INC

20 patents
US7259036B2Aug 21, 2007

Methods of forming doped and un-doped strained semiconductor materials and semiconductor films by gas-cluster-ion-beam irradiation and materials and film products

TEL EPION INC131 citations97
US7794798B2Sep 14, 2010

Method for depositing films using gas cluster ion beam processing

TEL EPION INC52 citations94
US7968422B2Jun 28, 2011

Method for forming trench isolation using a gas cluster ion beam growth process

TEL EPION INC22 citations93
US7410890B2Aug 12, 2008

Formation of doped regions and/or ultra-shallow junctions in semiconductor materials by gas-cluster ion irradiation

TEL EPION INC28 citations91
US7947582B2May 24, 2011

Material infusion in a trap layer structure using gas cluster ion beam processing

TEL EPION INC36 citations88
US8372489B2Feb 12, 2013

Method for directional deposition using a gas cluster ion beam

TEL EPION INC9 citations84
US8048788B2Nov 1, 2011

Method for treating non-planar structures using gas cluster ion beam processing

TEL EPION INC10 citations84
US7981483B2Jul 19, 2011

Method to improve electrical leakage performance and to minimize electromigration in semiconductor devices

TEL EPION INC7 citations84
US7905199B2Mar 15, 2011

Method and system for directional growth using a gas cluster ion beam

TEL EPION INC8 citations84
US7825389B2Nov 2, 2010

Method and apparatus for controlling a gas cluster ion beam formed from a gas mixture

TEL EPION INC15 citations84
US7291558B2Nov 6, 2007

Copper interconnect wiring and method of forming thereof

TEL EPION INC17 citations84
US7799683B2Sep 21, 2010

Copper interconnect wiring and method and apparatus for forming thereof

TEL EPION INC9 citations83
US7396745B2Jul 8, 2008

Formation of ultra-shallow junctions by gas-cluster ion irradiation

TEL EPION INC12 citations83
US7838423B2Nov 23, 2010

Method of forming capping structures on one or more material layer surfaces

TEL EPION INC5 citations73
US7754588B2Jul 13, 2010

Method to improve a copper/dielectric interface in semiconductor devices

TEL EPION INC7 citations73
US7982196B2Jul 19, 2011

Method for modifying a material layer using gas cluster ion beam processing

TEL EPION INC6 citations71
US8691103B2Apr 8, 2014

Surface profile adjustment using gas cluster ion beam processing

TEL EPION INC2 citations63
US8709944B2Apr 29, 2014

Method to alter silicide properties using GCIB treatment

TEL EPION INC1 citations62
US8703607B2Apr 22, 2014

Method to alter silicide properties using GCIB treatment

TEL EPION INC1 citations62
US7883999B2Feb 8, 2011

Method for increasing the penetration depth of material infusion in a substrate using a gas cluster ion beam

TEL EPION INC4 citations61

HAUTALA JOHN J

9 patents

TOKYO ELECTRON LTD

7 patents

VARIAN SEMICONDUCTOR EQUIPMENT

6 patents

EPION CORP

3 patents

RUSSELL NOEL

3 patents

TEL EPION CORP

1 patent