Inventor
CHEN TANG-YUAN
TW14 patents
Patents
14 patentsUS9478500B2Oct 25, 2016
Interposer substrate, semiconductor structure and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG10 citations82
US10332862B2Jun 25, 2019
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG6 citations81
US10586716B2Mar 10, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG7 citations80
US10217649B2Feb 26, 2019
Semiconductor device package having an underfill barrier
ADVANCED SEMICONDUCTOR ENG9 citations80
US11742324B2Aug 29, 2023
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US11011496B2May 18, 2021
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations72
US10770369B2Sep 8, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG5 citations71
US12272766B2Apr 8, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US12166009B2Dec 10, 2024
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US11594660B2Feb 28, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US11164756B2Nov 2, 2021
Semiconductor device package having continously formed tapered protrusions
ADVANCED SEMICONDUCTOR ENG0 citations59
US11227823B2Jan 18, 2022
Wiring structure
ADVANCED SEMICONDUCTOR ENG0 citations51
US9589871B2Mar 7, 2017
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations51
US10840219B2Nov 17, 2020
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49