Inventor
YANG JIN-FENG
TW10 patents
⚠️ This page may combine multiple inventors who share the name “YANG JIN-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
9 patentsUS10332862B2Jun 25, 2019
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG6 citations81
US9484313B2Nov 1, 2016
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG10 citations81
US10770369B2Sep 8, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG5 citations71
US9984983B2May 29, 2018
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG5 citations70
US11482482B2Oct 25, 2022
Substrate structures, methods for forming the same and semiconductor device structures comprising the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11024557B2Jun 1, 2021
Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die
ADVANCED SEMICONDUCTOR ENG0 citations59
US10840219B2Nov 17, 2020
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US11075186B2Jul 27, 2021
Semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations47
US10410942B2Sep 10, 2019
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations47