Inventor

JEONG SE YOUNG

KR29 patents

⚠️ This page may combine multiple inventors who share the name “JEONG SE YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEONG SE YOUNG

SAMSUNG ELECTRONICS CO LTD

Method for manufacturing wafer level chip stack package

Reinforced solder bump structure and method for forming a reinforced solder bump

Interconnection structure of integrated circuit chip

Reinforced solder bump structure and method for forming a reinforced solder bump

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack

Method of fabricating ultra thin flip-chip package

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Stacked multi-chip semiconductor package improving connection reliability of stacked chips

Method for forming solder bump structure

Method of forming solder bump with reduced surface defects

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Interconnection structure of integrated circuit chip

Stacked chip package and method for forming the same

Method of forming solder bump with reduced surface defects

Fabrication method of wafer level chip scale packages

NTRIUM INC

Electronic component package for electromagnetic interference shielding and method for manufacturing the same

Semiconductor package and method for manufacturing the same

Electronic component package for electromagnetic interference shielding and method for manufacturing the same

LEE HO-JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

Semiconductor device

LEE HO JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

PUSAN NATIONAL UNIV INDUSTRY UNIV COOPERATION FOUNDATION

Method for manufacturing silicon-coated copper, silicon-coated anti-oxidation copper using same, and semiconductor device using same

NAT UNIV PUSAN IND UNIV COOP FOUND

Large-area single-crystal silver thin-film structure using single-crystal copper thin-film buffer layer and manufacturing method therefor

PUSAN NATIONAL UNIV INDUSTRY—UNIV COOPERATION FOUNDATION

RF sputtering apparatus for controlling atomic layer of thin film

PUSAN NATIONAL UNIV INDUSTRIAL UNIV COOPERATION FOUNDATION

Electrode having nano mesh multi-layer structure, using single crystal copper, and manufacturing method therefor

JEONG SE-YOUNG

Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package

PUSAN NATIONAL UNIV INDUSTRIAL—UNIV COOPERATION FOUNDATION

Method for manufacturing single-crystalline metal ultrafine wire

JEONG SE YOUNG

Method of manufacturing single crystal wire and other single crystal metallic articles