Inventor
GHOSH SOMNATH
US45 patents
⚠️ This page may combine multiple inventors who share the name “GHOSH SOMNATH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS12444653B2Oct 14, 2025
Buried power rail at tight cell-to-cell space
IBM2 citations74
US12268031B2Apr 1, 2025
Backside power rails and power distribution network for density scaling
IBM2 citations74
US11139201B2Oct 5, 2021
Top via with hybrid metallization
IBM2 citations73
US10998193B1May 4, 2021
Spacer-assisted lithographic double patterning
IBM2 citations72
US12568814B2Mar 3, 2026
Buried power rail directly contacting backside power delivery network
IBM0 citations63
US12394660B2Aug 19, 2025
Buried power rail after replacement metal gate
IBM1 citations63
US12148833B2Nov 19, 2024
Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer
IBM0 citations63
US11817501B2Nov 14, 2023
Three-dimensional, monolithically stacked field effect transistors formed on the front and backside of a wafer
IBM0 citations63
US11004736B2May 11, 2021
Integrated circuit having a single damascene wiring network
IBM1 citations63
US12593468B2Mar 31, 2026
Self-aligned backside contact with increased contact area
IBM0 citations62
US12400871B2Aug 26, 2025
Metal lines with low via-to-via spacing
IBM0 citations62
US12020949B2Jun 25, 2024
Subtractive patterning of interconnect structures
IBM0 citations62
US11990412B2May 21, 2024
Buried power rails located in a base layer including first, second, and third etch stop layers
IBM1 citations62
US11854884B2Dec 26, 2023
Fully aligned top vias
IBM0 citations62
US11682617B2Jun 20, 2023
High aspect ratio vias for integrated circuits
IBM1 citations62
US11270913B2Mar 8, 2022
BEOL metallization formation
IBM0 citations62
US11217481B2Jan 4, 2022
Fully aligned top vias
IBM0 citations62
US11688636B2Jun 27, 2023
Spin on scaffold film for forming topvia
IBM0 citations61
US12046511B2Jul 23, 2024
Selective metal residue and liner cleanse for post-subtractive etch
IBM0 citations60
US12550711B2Feb 10, 2026
Interconnection fabric for buried power distribution
IBM0 citations52
US11244897B2Feb 8, 2022
Back end of line metallization
IBM0 citations52
US11177160B2Nov 16, 2021
Double patterned lithography using spacer assisted cuts for patterning steps
IBM0 citations52
US11062943B2Jul 13, 2021
Top via interconnects with wrap around liner
IBM0 citations52
US11024551B1Jun 1, 2021
Metal replacement vertical interconnections for buried capacitance
IBM0 citations52
US11527434B2Dec 13, 2022
Line cut patterning using sacrificial material
IBM0 citations51
US11158536B2Oct 26, 2021
Patterning line cuts before line patterning using sacrificial fill material
IBM0 citations51
US11830778B2Nov 28, 2023
Back-side wafer modification
IBM0 citations50
US11302571B2Apr 12, 2022
Cut integration for subtractive first metal line with bottom up second metal line
IBM0 citations48
INTEL CORP
5 patentsUS6721943B2Apr 13, 2004
Compile-time memory coalescing for dynamic arrays
INTEL CORP33 citations92
US6880154B2Apr 12, 2005
Alias-free test for dynamic array structures
INTEL CORP19 citations91
US7702856B2Apr 20, 2010
Dynamic prefetch distance calculation
INTEL CORP13 citations82
US10552934B2Feb 4, 2020
Reducing memory latency in graphics operations
INTEL CORP2 citations65
US10509653B2Dec 17, 2019
Vector processing system
INTEL CORP0 citations39
HONEYWELL INT INC
5 patentsUS11372383B1Jun 28, 2022
Healthy building dashboard facilitated by hierarchical model of building control assets
HONEYWELL INT INC7 citations82
US12111624B2Oct 8, 2024
Healthy building dashboard facilitated by hierarchical model of building control assets
HONEYWELL INT INC0 citations59
US11815865B2Nov 14, 2023
Healthy building dashboard facilitated by hierarchical model of building control assets
HONEYWELL INT INC0 citations59
US11599075B2Mar 7, 2023
Healthy building dashboard facilitated by hierarchical model of building control assets
HONEYWELL INT INC0 citations59
US11662115B2May 30, 2023
Hierarchy model builder for building a hierarchical model of control assets
HONEYWELL INT INC0 citations46
GLOBALFOUNDRIES INC
5 patentsUS10083958B2Sep 25, 2018
Deep trench metal-insulator-metal capacitors
GLOBALFOUNDRIES INC2 citations72
US10818494B2Oct 27, 2020
Metal on metal multiple patterning
GLOBALFOUNDRIES INC2 citations71
US10510675B2Dec 17, 2019
Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident light
GLOBALFOUNDRIES INC2 citations65
US11398378B2Jul 26, 2022
Metal on metal multiple patterning
GLOBALFOUNDRIES INC0 citations61
US10643891B2May 5, 2020
Via structures and via patterning using oblique angle deposition processes
GLOBALFOUNDRIES INC0 citations45