Inventor
LIN TSUNG-WEI
TW36 patents
⚠️ This page may combine multiple inventors who share the name “LIN TSUNG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COOLER MASTER CO LTD
14 patentsUS12099385B2Sep 24, 2024
Cooling apparatus
COOLER MASTER CO LTD7 citations86
US11703217B1Jul 18, 2023
Light-emitting fan
COOLER MASTER CO LTD7 citations86
US10202981B2Feb 12, 2019
Modular fan blade
COOLER MASTER CO LTD9 citations83
US10656044B1May 19, 2020
Easy-to-mount leakage detection sleeve
COOLER MASTER CO LTD7 citations82
US12171083B2Dec 17, 2024
Variable-part liquid cooling pumping unit
COOLER MASTER CO LTD2 citations73
US11755079B2Sep 12, 2023
Computer device, casing, and water cooling heat dissipation device
COOLER MASTER CO LTD5 citations73
US9887609B2Feb 6, 2018
Shaftless fan structure having axial air slit
COOLER MASTER CO LTD2 citations72
US10781822B2Sep 22, 2020
Fan impeller with metallic blades and method for manufacturing the same
COOLER MASTER CO LTD3 citations71
US12408306B2Sep 2, 2025
Liquid cooled server chassis
COOLER MASTER CO LTD1 citations64
US12078190B2Sep 3, 2024
Liquid-cooling heat dissipation device
COOLER MASTER CO LTD0 citations52
US11497138B2Nov 8, 2022
Liquid storage device
COOLER MASTER CO LTD0 citations52
US10690143B2Jun 23, 2020
Vane, fan blade and fan including the same
COOLER MASTER CO LTD0 citations52
US11943895B2Mar 26, 2024
Liquid cooling device and electronic device
COOLER MASTER CO LTD0 citations46
US10233944B2Mar 19, 2019
Impeller structure with improved rotation stability
COOLER MASTER CO LTD0 citations41
WINBOND ELECTRONICS CORP
6 patentsUS11515252B2Nov 29, 2022
Layout of wordline and method of forming the same
WINBOND ELECTRONICS CORP2 citations71
US11876048B2Jan 16, 2024
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations61
US12148627B2Nov 19, 2024
Method for forming semiconductor memory structure
WINBOND ELECTRONICS CORP0 citations51
US11545360B2Jan 3, 2023
Semiconductor device and manufacturing method of the same
WINBOND ELECTRONICS CORP0 citations49
US12581647B2Mar 17, 2026
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations48
US12456639B2Oct 28, 2025
Pick-up structure for memory device and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations48
ULEAD SYSTEMS INC
3 patentsUS6774894B1Aug 10, 2004
Processing method for rendering a 3-dimensional arrow object
ULEAD SYSTEMS INC13 citations79
US6545674B1Apr 8, 2003
Method of selectively rendering graphic objects three-dimensional
ULEAD SYSTEMS INC5 citations62
US7075529B1Jul 11, 2006
Method of processing diverse three-dimensional graphic objects
ULEAD SYSTEMS INC1 citations52