Inventor
LIN CHIA-CHIEH
TW14 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIA-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11798916B2Oct 24, 2023
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations85
US10056353B2Aug 21, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9553020B2Jan 24, 2017
Interconnect structure for connecting dies and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US10096515B2Oct 9, 2018
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12476224B2Nov 18, 2025
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915977B2Feb 27, 2024
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10978345B2Apr 13, 2021
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10840287B2Nov 17, 2020
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10361234B2Jul 23, 2019
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941320B2Apr 10, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9406712B2Aug 2, 2016
Interconnect structure for connecting dies and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52