Inventor

SWOBODA MARKO

DE20 patents

⚠️ This page may combine multiple inventors who share the name “SWOBODA MARKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SWOBODA MARKO

SILTECTRA GMBH

Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack

Method for reducing the thickness of solid-state layers provided with components

Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components

Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

Method for thinning solid body layers provided with components

Method for producing wafers with modification lines of defined orientation

Method for guiding a crack in the peripheral region of a donor substrate

Production facility for separating wafers from donor substrates

Method for modifying substrates based on crystal lattice dislocation density

Method and device for producing planar modifications in solid bodies

Laser conditioning of solid bodies using prior knowledge from previous machining steps

Method for thinning solid-body layers provided with components

Combined laser treatment of a solid body to be split

Method for guiding a crack in the peripheral region of a donor substrate

Method for producing short subcritical cracks in solid bodies

Polymer hybrid material for use in a splitting method

INFINEON TECHNOLOGIES AG

Method for splitting semiconductor wafers

Method and apparatus for producing at least one modification in a solid body

Method and apparatus for producing at least one modification in a solid body

Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices