Inventor
CHANG KAI-FUNG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHANG KAI-FUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
27 patentsUS11075238B2Jul 27, 2021
Method of manufacturing image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10734429B2Aug 4, 2020
Pad structure for backside illuminated (BSI) image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10367018B2Jul 30, 2019
Image sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10343895B2Jul 9, 2019
Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10150664B2Dec 11, 2018
Microelectromechanical systems (MEMS) stopper structure for stiction improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10109666B2Oct 23, 2018
Pad structure for backside illuminated (BSI) image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9926190B2Mar 27, 2018
MEMS devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9540231B2Jan 10, 2017
MEMS device with a bonding layer embedded in the cap
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12166067B2Dec 10, 2024
Titanium layer as getter layer for hydrogen in a MIM device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12082505B2Sep 3, 2024
Integrated heater (and related method) to recover degraded piezoelectric device performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11730058B2Aug 15, 2023
Integrated heater (and related method) to recover degraded piezoelectric device performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322580B2May 3, 2022
Titanium layer as getter layer for hydrogen in a MIM device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12568854B2Mar 3, 2026
Semiconductor packages having semiconductor blocks surrounding semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11289568B2Mar 29, 2022
Reduction of electric field enhanced moisture penetration by metal shielding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10981779B2Apr 20, 2021
MEMS devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11513287B2Nov 29, 2022
Waveguide structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12593732B2Mar 31, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10865100B2Dec 15, 2020
Method for forming micro-electro-mechanical system (MEMS) structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10266400B2Apr 23, 2019
MEMS device with multi pressure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10112822B2Oct 30, 2018
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9868630B2Jan 16, 2018
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9764948B2Sep 19, 2017
MEMS cap with multi pressure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10712500B2Jul 14, 2020
Semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12512384B2Dec 30, 2025
Semiconductor package with electrically conductive structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12354929B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US12334424B2Jun 17, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US10861929B2Dec 8, 2020
Electronic device including a capacitor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41