Inventor

KINSLEY THOMAS H

US81 patents

⚠️ This page may combine multiple inventors who share the name “KINSLEY THOMAS H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KINSLEY THOMAS H

MICRON TECHNOLOGY INC

Memory stacking system and method

Memory stacking system and method

Semiconductor device assembles with electrically functional heat transfer structures

Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems

Method and system for reducing the peak current in refreshing dynamic random access memory devices

Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

Semiconductor device assemblies with electrically functional heat transfer structures

Semiconductor device assemblies with lids including circuit elements

Methods for on-die memory termination and memory devices and systems employing the same

Memory devices configured to provide external regulated voltages

Semiconductor device assemblies with annular interposers

Semiconductor device assemblies with lids including circuit elements

Power management for a memory device

Refresh operation in multi-die memory

Sensing and tuning for memory die power management

Memory device power management

Methods for on-die memory termination and memory devices and systems employing the same

Semiconductor packages with pass-through clock traces and associated systems and methods

Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities

Configurable data path for memory modules

Tubular heat spreaders for memory modules and memory modules incorporating the same

Sensing and tuning for memory die power management

Refresh operation in multi-die memory

Semiconductor packages with pass-through clock traces and associated systems and methods

Methods for on-die memory termination and memory devices and systems employing the same

Dynamic allocation of a capacitive component in a memory device

Integrated semiconductor assemblies and methods of manufacturing the same

Memory devices configured to provide external regulated voltages

Semiconductor assemblies using edge stacking and methods of manufacturing the same

Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology

Techniques for power management using loopback

Semiconductor assemblies using edge stacking and methods of manufacturing the same

Memory devices configured to provide external regulated voltages

Semiconductor packages with pass-through clock traces and associated systems and methods

Semiconductor device assemblies with electrically functional heat transfer structures

Methods for on-die memory termination and memory devices and systems employing the same

Semiconductor device assemblies with annular interposers

Techniques for power management using loopback

Memory devices configured to provide external regulated voltages

Methods for on-die memory termination and memory devices and systems employing the same

Semiconductor die assembly having a heat spreader that extends through an underlying interposer and related technology

Semiconductor device assemblies with lids including circuit elements

Edge connector including internal layer contact, printed circuit board and electronic module incorporating same

Predictive power management

Dynamic allocation of a capacitive component in a memory device

LODESTAR LICENSING GROUP LLC

Memory devices configured to provide external regulated voltages

Techniques for power management using loopback

Configurable data path for memory modules

Refresh operation in multi-die memory

Configurable data path for memory modules