Inventor
MINEGISHI TOMONORI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “MINEGISHI TOMONORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MINEGISHI TOMONORI
7 patentsUS8871422B2Oct 28, 2014
Negative-type photosensitive resin composition, pattern forming method and electronic parts
MINEGISHI TOMONORI6 citations82
US8758977B2Jun 24, 2014
Negative-type photosensitive resin composition, pattern forming method and electronic parts
MINEGISHI TOMONORI8 citations82
US8304160B2Nov 6, 2012
Photosensitive resin composition and circuit formation substrate using the same
MINEGISHI TOMONORI8 citations80
US8298747B2Oct 30, 2012
Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
MINEGISHI TOMONORI10 citations80
US9274422B2Mar 1, 2016
Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component
MINEGISHI TOMONORI2 citations61
US8614051B2Dec 24, 2013
Photosensitive resin composition and circuit formation substrate using the same
MINEGISHI TOMONORI3 citations59
US8420291B2Apr 16, 2013
Positive photosensitive resin composition, method for forming pattern, electronic component
MINEGISHI TOMONORI0 citations34
HITACHI CHEMICAL CO LTD
5 patentsUS11330721B2May 10, 2022
Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film
HITACHI CHEMICAL CO LTD1 citations71
US11147166B2Oct 12, 2021
Method for producing semiconductor device
HITACHI CHEMICAL CO LTD1 citations71
US10674612B2Jun 2, 2020
Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer
HITACHI CHEMICAL CO LTD3 citations71
US10575402B2Feb 25, 2020
Resin composition, wiring layer laminate for semiconductor, and semiconductor device
HITACHI CHEMICAL CO LTD1 citations61
US10428253B2Oct 1, 2019
Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device
HITACHI CHEMICAL CO LTD1 citations61