Inventor
EWANCHUK JEFFREY
FR29 patents
⚠️ This page may combine multiple inventors who share the name “EWANCHUK JEFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
20 patentsUS11251151B2Feb 15, 2022
System and method for allowing restoration of interconnection of die of power module
MITSUBISHI ELECTRIC CORP2 citations71
US11114349B2Sep 7, 2021
System and method for allowing restoration of first interconnection of die of power module
MITSUBISHI ELECTRIC CORP2 citations71
US10985088B2Apr 20, 2021
System comprising at least one power module comprising at least one power die that is cooled by liquid cooled system
MITSUBISHI ELECTRIC CORP5 citations71
US10277218B2Apr 30, 2019
System comprising multi-die power module, method for controlling operation of multi-die power module, device for controlling operation of multi-die power module
MITSUBISHI ELECTRIC CORP1 citations62
US11378612B2Jul 5, 2022
Device and method for monitoring the health of a power semiconductor die
MITSUBISHI ELECTRIC CORP0 citations61
US11955539B2Apr 9, 2024
Device and method for manufacturing device
MITSUBISHI ELECTRIC CORP0 citations60
US11448557B2Sep 20, 2022
Method and device for determining junction temperature of die of semiconductor power module
MITSUBISHI ELECTRIC CORP1 citations60
US11152340B2Oct 19, 2021
Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same
MITSUBISHI ELECTRIC CORP1 citations60
US10886871B2Jan 5, 2021
Method for controlling health of multi-die power module and multi-die health monitoring device
MITSUBISHI ELECTRIC CORP1 citations60
US11415625B2Aug 16, 2022
Device and method for monitoring multi-die power module
MITSUBISHI ELECTRIC CORP0 citations51
US10707744B2Jul 7, 2020
Device and method for controlling operation of power module composed of switches
MITSUBISHI ELECTRIC CORP0 citations51
US10367497B2Jul 30, 2019
System comprising multi-die power and method for controlling operation of multi-die power module
MITSUBISHI ELECTRIC CORP0 citations51
US10333385B2Jun 25, 2019
Method and device for controlling the operation of multi-die power module
MITSUBISHI ELECTRIC CORP0 citations51
US10084440B2Sep 25, 2018
System comprising a multi-die power module, and method for controlling the switching of a multi-die power module
MITSUBISHI ELECTRIC CORP0 citations51
US11630154B2Apr 18, 2023
Method and device for monitoring connection of semiconductor of power module
MITSUBISHI ELECTRIC CORP0 citations50
US11388845B2Jul 12, 2022
Multi-die temperature control device and method for controlling temperature of multi-die power module
MITSUBISHI ELECTRIC CORP0 citations49
US11217571B2Jan 4, 2022
Power module and method for manufacturing power module
MITSUBISHI ELECTRIC CORP0 citations49
US10732617B2Aug 4, 2020
Method, device and system for estimating level of damage of electric device using histograms
MITSUBISHI ELECTRIC CORP0 citations41
US10848052B2Nov 24, 2020
Device and method for controlling temperature of multi-die power module
MITSUBISHI ELECTRIC CORP0 citations39
US9515012B2Dec 6, 2016
Package of power dies and three-phase power converter
MITSUBISHI ELECTRIC CORP0 citations39
HAMILTON SUNDSTRAND CORP
6 patentsUS12176687B2Dec 24, 2024
Power converter
HAMILTON SUNDSTRAND CORP0 citations62
US12095368B2Sep 17, 2024
Compact circuit devices using ceramic-copper layers based packaging
HAMILTON SUNDSTRAND CORP0 citations62
US11424692B2Aug 23, 2022
Multi-level single-phase AC-to-DC converter
HAMILTON SUNDSTRAND CORP1 citations62
US11935807B2Mar 19, 2024
Plurality of dies electrically connected to a printed circuit board by a clip
HAMILTON SUNDSTRAND CORP0 citations57
US12592555B2Mar 31, 2026
Active turn off control gate driver for solid state circuit breaker
HAMILTON SUNDSTRAND CORP0 citations46
US12063763B2Aug 13, 2024
Cooling in conductors for chips
HAMILTON SUNDSTRAND CORP0 citations43