Inventor
BRANDELERO JULIO
FR9 patents
Patents
9 patentsUS11251151B2Feb 15, 2022
System and method for allowing restoration of interconnection of die of power module
MITSUBISHI ELECTRIC CORP2 citations71
US11114349B2Sep 7, 2021
System and method for allowing restoration of first interconnection of die of power module
MITSUBISHI ELECTRIC CORP2 citations71
US12416528B2Sep 16, 2025
Device and method for sensing an over-temperature of a power semiconductor
MITSUBISHI ELECTRIC CORP0 citations60
US11448557B2Sep 20, 2022
Method and device for determining junction temperature of die of semiconductor power module
MITSUBISHI ELECTRIC CORP1 citations60
US10886871B2Jan 5, 2021
Method for controlling health of multi-die power module and multi-die health monitoring device
MITSUBISHI ELECTRIC CORP1 citations60
US11630154B2Apr 18, 2023
Method and device for monitoring connection of semiconductor of power module
MITSUBISHI ELECTRIC CORP0 citations50
US12532416B2Jan 20, 2026
Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB
MITSUBISHI ELECTRIC CORP0 citations49
US11388845B2Jul 12, 2022
Multi-die temperature control device and method for controlling temperature of multi-die power module
MITSUBISHI ELECTRIC CORP0 citations49
US12480823B2Nov 25, 2025
Method and system for determining junction temperature of power semiconductor
MITSUBISHI ELECTRIC CORP0 citations47