Inventor
TENG YUN CHEN
TW15 patents
Patents
15 patentsUS11908708B2Feb 20, 2024
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11855040B2Dec 26, 2023
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12557612B2Feb 17, 2026
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12347696B2Jul 1, 2025
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327811B2Jun 10, 2025
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237211B2Feb 25, 2025
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230532B2Feb 18, 2025
Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11183426B2Nov 23, 2021
Method for forming a FinFET structure that prevents or reduces deformation of adjacent fins
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12283622B2Apr 22, 2025
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12266574B2Apr 1, 2025
Flowable chemical vapor deposition (FCVD) using multi-step anneal treatment and devices thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12249592B2Mar 11, 2025
Dynamic bonding gap control and tool for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11728406B2Aug 15, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12368129B2Jul 22, 2025
Temperature controllable bonder equipment for substrate bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12255171B2Mar 18, 2025
Wafer bonding system and method of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10868137B2Dec 15, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51