Inventor
TSAI CHEN-FONG
TW18 patents
Patents
18 patentsUS11908708B2Feb 20, 2024
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11855040B2Dec 26, 2023
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11901189B2Feb 13, 2024
Ambient controlled two-step thermal treatment for spin-on coating layer planarization
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12557612B2Feb 17, 2026
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12347696B2Jul 1, 2025
Laser de-bonding carriers and composite carriers thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327811B2Jun 10, 2025
Ion implantation with annealing for substrate cutting
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237211B2Feb 25, 2025
Bonding system with sealing gasket and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230532B2Feb 18, 2025
Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266574B2Apr 1, 2025
Flowable chemical vapor deposition (FCVD) using multi-step anneal treatment and devices thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12249592B2Mar 11, 2025
Dynamic bonding gap control and tool for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12211820B2Jan 28, 2025
Wafer bonding apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12132079B2Oct 29, 2024
Bonding and isolation techniques for stacked transistor structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11990404B2May 21, 2024
Heat dissipation for semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12040382B2Jul 16, 2024
Method of forming a nano-FET semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12438031B2Oct 7, 2025
Bonding system and method for using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12368129B2Jul 22, 2025
Temperature controllable bonder equipment for substrate bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12255171B2Mar 18, 2025
Wafer bonding system and method of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12087592B2Sep 10, 2024
Ambient controlled two-step thermal treatment for spin-on coating layer planarization
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50