Inventor

KOYAMA TAKAHIRO

JP62 patents

⚠️ This page may combine multiple inventors who share the name “KOYAMA TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOYAMA TAKAHIRO

SONY CORP

Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer

Light emitting element, method of manufacturing the same, and light emitting device

Distance measurement apparatus and distance measurement method

Distance measurement apparatus and distance measurement method

Semiconductor laser, electronic apparatus, and method of driving semiconductor laser

Semiconductor laser, electronic apparatus, and method of driving semiconductor laser

Still image pickup device and pickup method

Light-emitting device and image display apparatus with reflection film on side surface and layers having different refractive indices

Semiconductor laser drive circuit, method for driving semiconductor laser drive circuit, distance measuring apparatus, and electronic apparatus

Correction device, correction method, and distance measuring device

Image pickup apparatus

Image capturing apparatus and control method thereof using amplification ratio based on current accumulated exposure time

Distance measurement apparatus and vehicle

Ranging device, ranging method, signal processing device, and light projecting device

FUJI ELECTRIC CO LTD

Semiconductor module

Semiconductor module

Semiconductor module

Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plate

Power semiconductor module, flow path member, and power-semiconductor-module structure

Cooler and semiconductor device having cooler

Semiconductor cooling apparatus with uniform flow distribution structures

Cooling apparatus, semiconductor module, and vehicle

Semiconductor module

Cooler and semiconductor apparatus

Semiconductor module and vehicle

KOYAMA TAKAHIRO

Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals

Inspection apparatus, image forming system, misalignment measurement method and storage medium

Semiconductor device

SUMITOMO LIGHT METAL IND

Aluminum alloy piping material for automotive piping excelling in corrosion resistance and workability

Fuel filler pipe for automobile

Aluminum plates for automobile body panels and method of pretreatment for painting thereof

DENSO CORP

Brazing sheet having an excellent corrosion resistance for use in a heat exchanger, and a heat exchanger using the same

Aluminum alloy piping material having an excellent corrosion resistance and workability

FUJI XEROX CO LTD

Image search system, image search method, and storage medium

Image search system, image search method, and storage medium

SONY SEMICONDUCTOR SOLUTIONS CORP

Light-emitting element wafer, light emitting element, electronic apparatus

Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer

SONY GROUP CORP

Light-emitting device and image display apparatus

Imaging device, processing device, data transmission system, and data transmission method for transmission of image data

DAICEL CHEM

Process for the preparation of a powdery calcium cellulose glycolate

Waving lotion composition

CANON DENSHI KK

Machining tool

DAICEL LTD

Melt-coated preparation containing sorbic acid

KITA MITSUAKI

Imaging apparatus, imaging control method, and imaging control program

TAGUCHI JUN

Process for the production of calcium cellulose glycolate

MINAKUTI JUN

Imaging apparatus, control method thereof, and program

PANASONIC CORP

High-frequency receiver having a gain switch controller

MASHIKO YOHTA

Information processing apparatus, output method, and non-transitory computer-readable storage medium which highlights an abnormality before correction

UACJ CORP

Surface-treated aluminum material and method for manufacturing same; and bonded body of surface-treated aluminum material and bonding member comprising said surface-treated aluminum material, and bonding member such as resin, and method for manufacturing said bonded body