Inventor

TAI KING L

US22 patents

⚠️ This page may combine multiple inventors who share the name “TAI KING L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAI KING L

AT & T BELL LAB

Debondable metallic bonding method

Integrated circuit package and compact assemblies thereof

Permanent metallic bonding method

Movable fiber optical switch

Method for fabricating devices with DC bias-controlled reactive ion etching

Optical assembly comprising optical fiber coupling means

Optical fiber switch

Anisotropic wet etching of chalcogenide glass resists

AMERICAN TELEPHONE & TELEGRAPH

Integrated circuit chip-and-substrate assembly

Interconnection lines for wafer-scale-integrated assemblies

Optical fiber switch

Nonplanar lithography and devices formed thereby

AT & T CORP

Method for making multichip circuits using active semiconductor substrates

Temporary connections for fast electrical access to electronic devices

Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing

LUCENT TECHNOLOGIES INC

Packaging multi-chip modules without wire-bond interconnection

Method and apparatus for assembling multichip modules

Bonding scheme using group VB metallic layer

BELL TELEPHONE LABOR INC

Multiple exposure microlithography patterning method

Photoinduced migration of silver into chalcogenide layer

KATZ AVISHAY

Bonding method using solder composed of multiple alternating gold and tin layers

AVAYA TECHNOLOGY CORP

Method of tuning a planar filter with additional coupling created by bent resonator elements