Inventor
BURGESS JAMES F
US16 patents
Patents
16 patentsUS5637922AJun 10, 1997
Wireless radio frequency power semiconductor devices using high density interconnect
GEN ELECTRIC272 citations99
US5532512AJul 2, 1996
Direct stacked and flip chip power semiconductor device structures
GEN ELECTRIC377 citations98
US5103290AApr 7, 1992
Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
GEN ELECTRIC62 citations96
US5028987AJul 2, 1991
High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
GEN ELECTRIC52 citations96
US4803450AFeb 7, 1989
Multilayer circuit board fabricated from silicon
GEN ELECTRIC73 citations96
US5293070AMar 8, 1994
Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules
GEN ELECTRIC59 citations93
US5324987AJun 28, 1994
Electronic apparatus with improved thermal expansion match
GEN ELECTRIC34 citations92
US5166773ANov 24, 1992
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
GEN ELECTRIC50 citations92
US5135890AAug 4, 1992
Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
GEN ELECTRIC49 citations92
US5105536AApr 21, 1992
Method of packaging a semiconductor chip in a low inductance package
GEN ELECTRIC51 citations92
US5100740AMar 31, 1992
Direct bonded symmetric-metallic-laminate/substrate structures
GEN ELECTRIC35 citations92
US4996116AFeb 26, 1991
Enhanced direct bond structure
GEN ELECTRIC50 citations92
US4711804ADec 8, 1987
Circuit board construction
GEN ELECTRIC45 citations92
US3993411ANov 23, 1976
Bonds between metal and a non-metallic substrate
GEN ELECTRIC103 citations91
US4103274AJul 25, 1978
Reconstituted metal oxide varistor
GEN ELECTRIC29 citations80
US5209390AMay 11, 1993
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
GEN ELECTRIC18 citations74