Inventor

UH JI HO

KR5 patents

⚠️ This page may combine multiple inventors who share the name “UH JI HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

4 patents

US11098406B2Aug 24, 2021

Substrate support unit and deposition apparatus including the same

SAMSUNG ELECTRONICS CO LTD5 citations65

US11021796B2Jun 1, 2021

Gas injectors and wafer processing apparatuses having the same

SAMSUNG ELECTRONICS CO LTD1 citations61

US9263414B2Feb 16, 2016

Flip chip packaging method, and flux head manufacturing method applied to the same

SAMSUNG ELECTRONICS CO LTD2 citations59

US12552619B2Feb 17, 2026

Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus

SAMSUNG ELECTRONICS CO LTD0 citations43

UH JI HO

1 patent

US8482870B2Jul 9, 2013

Lens module and wafer level lens module manufacturing apparatus

UH JI HO0 citations39