Inventor
URUSHIMA MICHITAKA
JP12 patents
⚠️ This page may combine multiple inventors who share the name “URUSHIMA MICHITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
11 patentsUS5474957ADec 12, 1995
Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
NEC CORP291 citations98
US6372549B2Apr 16, 2002
Semiconductor package and semiconductor package fabrication method
NEC CORP49 citations95
US5869887AFeb 9, 1999
Semiconductor package fabricated by using automated bonding tape
NEC CORP65 citations95
US5350947ASep 27, 1994
Film carrier semiconductor device
NEC CORP81 citations94
US6046495AApr 4, 2000
Semiconductor device having a tab tape and a ground layer
NEC CORP32 citations92
US5686757ANov 11, 1997
Film carrier tape for use in tape automated bonding
NEC CORP28 citations92
US5743459AApr 28, 1998
Method for fabricating semiconductor device with step of bonding lead frame leads to chip pads
NEC CORP8 citations73
US5503321AApr 2, 1996
Bonding tool employed in ultrasonic compression bonding apparatus
NEC CORP18 citations73
US6515357B2Feb 4, 2003
Semiconductor package and semiconductor package fabrication method
NEC CORP3 citations62
US6173884B1Jan 16, 2001
Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same
NEC CORP3 citations62
US5662263ASep 2, 1997
Single point bonding method
NEC CORP6 citations62