Inventor
MIZUTANI DAISUKE
JP36 patents
⚠️ This page may combine multiple inventors who share the name “MIZUTANI DAISUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
23 patentsUS5478972ADec 26, 1995
Multilayer circuit board and a method for fabricating the same
FUJITSU LTD111 citations98
US5386430AJan 31, 1995
Excimer laser processing method and apparatus
FUJITSU LTD46 citations89
US9326372B2Apr 26, 2016
Semiconductor device manufacturing method and semiconductor mounting substrate
FUJITSU LTD5 citations83
US5429709AJul 4, 1995
Method of manufacturing polyimide multilayer printed wiring boards
FUJITSU LTD7 citations73
US11057996B2Jul 6, 2021
Circuit board, method of manufacturing circuit board, and electronic device
FUJITSU LTD3 citations72
US9699887B2Jul 4, 2017
Circuit board and electronic device
FUJITSU LTD6 citations71
US6992861B2Jan 31, 2006
Head suspension for swing arm actuator
FUJITSU LTD4 citations63
US9048332B2Jun 2, 2015
Semiconductor device manufacturing method and semiconductor mounting substrate
FUJITSU LTD2 citations62
US7996196B2Aug 9, 2011
Structural analysis of a printed wiring substrate
FUJITSU LTD2 citations62
US7671281B2Mar 2, 2010
Multilayer wiring circuit board
FUJITSU LTD5 citations62
US7253023B2Aug 7, 2007
Multilayer wiring circuit board
FUJITSU LTD3 citations62
US10311189B2Jun 4, 2019
Simulation method and simulation apparatus
FUJITSU LTD1 citations60
US11317520B2Apr 26, 2022
Circuit board, method of manufacturing circuit board, and electronic device
FUJITSU LTD0 citations59
US10896871B2Jan 19, 2021
Circuit board, method for manufacturing circuit board, and electronic device
FUJITSU LTD1 citations58
US7851707B2Dec 14, 2010
Circuit board and method for manufacturing the same
FUJITSU LTD2 citations55
US7791197B2Sep 7, 2010
Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member
FUJITSU LTD1 citations52
US10770386B2Sep 8, 2020
Wiring board, electronic device, and wiring board manufacturing method
FUJITSU LTD0 citations51
US10701808B2Jun 30, 2020
Capacitor built-in multilayer wiring substrate and manufacturing method thereof
FUJITSU LTD0 citations51
US10362677B2Jul 23, 2019
Capacitor built-in multilayer wiring substrate and manufacturing method thereof
FUJITSU LTD0 citations51
US9754830B2Sep 5, 2017
Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device
FUJITSU LTD0 citations49
US9055685B2Jun 9, 2015
Electric circuit apparatus and manufacturing method therefor
FUJITSU LTD1 citations49
US8952271B2Feb 10, 2015
Circuit board, semiconductor device, and method of manufacturing semiconductor device
FUJITSU LTD0 citations39
US10396020B2Aug 27, 2019
Method of manufacturing board
FUJITSU LTD0 citations37
MITSUBISHI ELECTRIC CORP
4 patentsUSD884725SMay 19, 2020
Display screen with graphical user interface
MITSUBISHI ELECTRIC CORP65 citations95
USD881918SApr 21, 2020
Display screen with graphical user interface
MITSUBISHI ELECTRIC CORP57 citations95
USD894923SSep 1, 2020
Display screen with animated graphical user interface
MITSUBISHI ELECTRIC CORP15 citations83
USD873295SJan 21, 2020
Display screen with animated graphical user interface
MITSUBISHI ELECTRIC CORP9 citations81
NIPPON ZEON CO
4 patentsUS6001488ADec 14, 1999
Composition of epoxy group-containing cycloolefin resin
NIPPON ZEON CO58 citations95
US5895800AApr 20, 1999
Composition of epoxy group-containing cycloolefin resin
NIPPON ZEON CO21 citations91
US5777068AJul 7, 1998
Photosensitive polyimide resin composition
NIPPON ZEON CO11 citations73
US5886136AMar 23, 1999
Pattern forming process
NIPPON ZEON CO12 citations71