Inventor
SHEPELA ADAM
US6 patents
⚠️ This page may combine multiple inventors who share the name “SHEPELA ADAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMPAQ COMPUTER CORP
2 patentsUS6060387AMay 9, 2000
Transistor fabrication process in which a contact metallization is formed with different silicide thickness over gate interconnect material and transistor source/drain regions
COMPAQ COMPUTER CORP53 citations91
US6245996B1Jun 12, 2001
Electrical interconnect structure having electromigration-inhibiting segments
COMPAQ COMPUTER CORP30 citations90
HEWLETT PACKARD DEVELOPMENT CO
2 patentsUS7062850B2Jun 20, 2006
Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length
HEWLETT PACKARD DEVELOPMENT CO24 citations90
US6678951B2Jan 20, 2004
Method of forming electrical interconnects having electromigration-inhibiting plugs
HEWLETT PACKARD DEVELOPMENT CO15 citations90