Inventor
WANG JAMES JEN-HO
US22 patents
⚠️ This page may combine multiple inventors who share the name “WANG JAMES JEN-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
8 patentsUS7619297B2Nov 17, 2009
Electronic device including an inductor
FREESCALE SEMICONDUCTOR INC71 citations98
US6790759B1Sep 14, 2004
Semiconductor device with strain relieving bump design
FREESCALE SEMICONDUCTOR INC46 citations93
US7524731B2Apr 28, 2009
Process of forming an electronic device including an inductor
FREESCALE SEMICONDUCTOR INC43 citations92
US6888246B2May 3, 2005
Semiconductor power device with shear stress compensation
FREESCALE SEMICONDUCTOR INC22 citations92
US7868729B2Jan 11, 2011
Stacked device assembly with integrated coil and method of forming same
FREESCALE SEMICONDUCTOR INC13 citations82
US7339275B2Mar 4, 2008
Multi-chips semiconductor device assemblies and methods for fabricating the same
FREESCALE SEMICONDUCTOR INC14 citations82
US7705440B2Apr 27, 2010
Substrate having through-wafer vias and method of forming
FREESCALE SEMICONDUCTOR INC7 citations74
US7615866B2Nov 10, 2009
Contact surrounded by passivation and polymide and method therefor
FREESCALE SEMICONDUCTOR INC6 citations54
WANG JAMES JEN-HO
6 patentsUS8879276B2Nov 4, 2014
Flexible circuit assembly and method thereof
WANG JAMES JEN-HO70 citations97
USD732731SJun 23, 2015
Electronic fixture
WANG JAMES JEN-HO12 citations83
US9799448B2Oct 24, 2017
Inductor, transformer, and method
WANG JAMES JEN-HO2 citations72
US9704644B2Jul 11, 2017
Flexible circuit assembly and method therof
WANG JAMES JEN-HO2 citations72
US8890287B2Nov 18, 2014
Integrated nano-farad capacitors and method of formation
WANG JAMES JEN-HO2 citations62
US8153510B2Apr 10, 2012
Semiconductor bond pad patterns and method of formation
WANG JAMES JEN-HO4 citations62
MOTOROLA INC
4 patentsUS6646347B2Nov 11, 2003
Semiconductor power device and method of formation
MOTOROLA INC137 citations98
US5860585AJan 19, 1999
Substrate for transferring bumps and method of use
MOTOROLA INC71 citations95
US6001493ADec 14, 1999
Substrate for transferring bumps and method of use
MOTOROLA INC26 citations92
US7208841B2Apr 24, 2007
Semiconductor device with strain relieving bump design
MOTOROLA INC9 citations70