Inventor
PRACK EDWARD R
US27 patents
⚠️ This page may combine multiple inventors who share the name “PRACK EDWARD R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS8987918B2Mar 24, 2015
Interconnect structures with polymer core
INTEL CORP54 citations98
US7428138B2Sep 23, 2008
Forming carbon nanotube capacitors
INTEL CORP31 citations92
US9508667B2Nov 29, 2016
Formation of solder and copper interconnect structures and associated techniques and configurations
INTEL CORP10 citations84
US7462551B2Dec 9, 2008
Adhesive system for supporting thin silicon wafer
INTEL CORP17 citations81
US10068863B2Sep 4, 2018
Formation of solder and copper interconnect structures and associated techniques and configurations
INTEL CORP4 citations73
US9583390B2Feb 28, 2017
Organic thin film passivation of metal interconnections
INTEL CORP3 citations71
US9859248B2Jan 2, 2018
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations68
US9824991B2Nov 21, 2017
Organic thin film passivation of metal interconnections
INTEL CORP1 citations61
US9412702B2Aug 9, 2016
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations58
US10128225B2Nov 13, 2018
Interconnect structures with polymer core
INTEL CORP0 citations52
US9613934B2Apr 4, 2017
Interconnect structures with polymer core
INTEL CORP0 citations52
US9165914B2Oct 20, 2015
Forming die backside coating structures with coreless packages
INTEL CORP0 citations51
US10573622B2Feb 25, 2020
Methods of forming joint structures for surface mount packages
INTEL CORP0 citations50
US10049971B2Aug 14, 2018
Package structure to enhance yield of TMI interconnections
INTEL CORP0 citations48
FREESCALE SEMICONDUCTOR INC
4 patentsUS6921975B2Jul 26, 2005
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
FREESCALE SEMICONDUCTOR INC233 citations98
US6838776B2Jan 4, 2005
Circuit device with at least partial packaging and method for forming
FREESCALE SEMICONDUCTOR INC314 citations98
US7361987B2Apr 22, 2008
Circuit device with at least partial packaging and method for forming
FREESCALE SEMICONDUCTOR INC75 citations97
US6888246B2May 3, 2005
Semiconductor power device with shear stress compensation
FREESCALE SEMICONDUCTOR INC22 citations92