Inventor
HUNG CHIN-YUAN
TW8 patents
Patents
8 patentsUS6476474B1Nov 5, 2002
Dual-die package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD245 citations97
US6509636B1Jan 21, 2003
Semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD84 citations96
US6476469B2Nov 5, 2002
Quad flat non-leaded package structure for housing CMOS sensor
SILICONWARE PRECISION INDUSTRIES CO LTD277 citations96
US6696749B1Feb 24, 2004
Package structure having tapering support bars and leads
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations91
US6396129B1May 28, 2002
Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD36 citations91
US6437447B1Aug 20, 2002
Dual-sided chip package without a die pad
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations89
US6495908B2Dec 17, 2002
Multi-chip semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD22 citations83
US6680531B2Jan 20, 2004
Multi-chip semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations78