Inventor
CHIANG LIEN-CHEN
TW7 patents
Patents
7 patentsUS6476469B2Nov 5, 2002
Quad flat non-leaded package structure for housing CMOS sensor
SILICONWARE PRECISION INDUSTRIES CO LTD277 citations96
US6696749B1Feb 24, 2004
Package structure having tapering support bars and leads
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations91
US7180161B2Feb 20, 2007
Lead frame for improving molding reliability and semiconductor package with the lead frame
SILICONWARE PRECISION INDUSTRIES CO LTD11 citations80
US6777266B2Aug 17, 2004
Dual-chip integrated circuit package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations73
US6642735B2Nov 4, 2003
Semiconductor package for chip with testing contact pad connected to outside
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59
US7459770B2Dec 2, 2008
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations57
US9355989B2May 31, 2016
Wire bonding device and method of eliminating defective bonding wire
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations43