Inventor
SHI SONG-HUA
US18 patents
⚠️ This page may combine multiple inventors who share the name “SHI SONG-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS7179684B2Feb 20, 2007
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
INTEL CORP19 citations92
US6899960B2May 31, 2005
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
INTEL CORP23 citations92
US6730542B2May 4, 2004
Polybenzoxazine based wafer-level underfill material
INTEL CORP16 citations92
US7323360B2Jan 29, 2008
Electronic assemblies with filled no-flow underfill
INTEL CORP32 citations90
US6703299B2Mar 9, 2004
Underfill process for flip-chip device
INTEL CORP19 citations90
US6902954B2Jun 7, 2005
Temperature sustaining flip chip assembly process
INTEL CORP12 citations84
US6794761B2Sep 21, 2004
No-flow underfill material
INTEL CORP15 citations84
US7498678B2Mar 3, 2009
Electronic assemblies and systems with filled no-flow underfill
INTEL CORP9 citations82
US7218007B2May 15, 2007
Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices
INTEL CORP12 citations80
US6940053B2Sep 6, 2005
Chip bonding heater with differential heat transfer
INTEL CORP9 citations73
US6727594B2Apr 27, 2004
Polybenzoxazine based wafer-level underfill material
INTEL CORP10 citations73
US7470564B2Dec 30, 2008
Flip-chip system and method of making same
INTEL CORP5 citations63
US7391119B2Jun 24, 2008
Temperature sustaining flip chip assembly process
INTEL CORP3 citations62
US7176422B2Feb 13, 2007
Chip bonding heater with differential heat transfer
INTEL CORP4 citations62
US7145120B2Dec 5, 2006
Guided heating apparatus and method for using the same
INTEL CORP2 citations62
US6794623B2Sep 21, 2004
Guided heating apparatus and method for using the same
INTEL CORP3 citations62