P

Inventor

RYU JAE-CHUL

KR11 patents
⚠️ This page may combine multiple inventors who share the name “RYU JAE-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG TECHWIN CO LTD

4 patents
US7470461B2Dec 30, 2008

Printed circuit board and method of manufacturing the same

SAMSUNG TECHWIN CO LTD8 citations71
US7199462B2Apr 3, 2007

Substrate for producing semiconductor packages

SAMSUNG TECHWIN CO LTD5 citations61
US7804693B2Sep 28, 2010

Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same

SAMSUNG TECHWIN CO LTD3 citations60
US7811626B2Oct 12, 2010

Printed circuit board and method of manufacturing the same

SAMSUNG TECHWIN CO LTD0 citations49

SAMSUNG AEROSPACE IND

3 patents
US5877941AMar 2, 1999

IC card and method of fabricating the same

SAMSUNG AEROSPACE IND49 citations91
US5747222AMay 5, 1998

Multi-layered circuit substrate and manufacturing method thereof

SAMSUNG AEROSPACE IND32 citations91
US6074728AJun 13, 2000

Multi-layered circuit substrate

SAMSUNG AEROSPACE IND7 citations72

RYU JAE-CHUL

2 patents
US8122599B2Feb 28, 2012

Method of manufacturing a printed circuit board (PCB)

RYU JAE-CHUL1 citations45
US8227173B2Jul 24, 2012

Method of manufacturing multi-layer circuit board

RYU JAE-CHUL0 citations35

HANWHA TECHWIN CO LTD

1 patent
US9373429B2Jun 21, 2016

Method of obtaining graphene

HANWHA TECHWIN CO LTD0 citations51

HAESUNG DS CO LTD

1 patent
US10714231B2Jul 14, 2020

Graphene wire, cable employing the same, and method of manufacturing the same

HAESUNG DS CO LTD0 citations50