Inventor
BERRY MICHELE J
US6 patents
⚠️ This page may combine multiple inventors who share the name “BERRY MICHELE J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS6992891B2Jan 31, 2006
Metal ball attachment of heat dissipation devices
INTEL CORP58 citations93
US6974765B2Dec 13, 2005
Encapsulation of pin solder for maintaining accuracy in pin position
INTEL CORP5 citations71
US7211888B2May 1, 2007
Encapsulation of pin solder for maintaining accuracy in pin position
INTEL CORP4 citations60
US6867060B2Mar 15, 2005
Wafer-level packaging of electronic devices before singulation
INTEL CORP2 citations54