Inventor

ZENG XIANG YIN

CN20 patents

⚠️ This page may combine multiple inventors who share the name “ZENG XIANG YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZENG XIANG YIN

INTEL CORP

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

Reducing parasitic mutual capacitances

Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same

Extended thin film capacitor (TFC)

Package level integration of antenna and RF front-end module

Data signal interconnection with reduced crosstalk

IC package with signal land pads

Dual die package with high-speed interconnect

Extended thin film capacitor (TFC)

Multi-chip assembly with optically coupled die

Array capacitor apparatuses to filter input/output signal

Multi-chip assembly with optically coupled die

Package level noise isolation

Reducing input capacitance of high speed integrated circuits

Packaged spiral inductor structures, processes of making same, and systems containing same

Copper plating connection for multi-die stack in substrate package

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Substrate with lossy material insert

ZHOU QING A

Multi-chip assembly with optically coupled die