P

Inventor

LIM KEN BENG

MY5 patents
⚠️ This page may combine multiple inventors who share the name “LIM KEN BENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIM KEN BENG

3 patents
US8598698B1Dec 3, 2013

Package substrate with an embedded stiffener

LIM KEN BENG17 citations78
US9054077B2Jun 9, 2015

Package having spaced apart heat sink

LIM KEN BENG2 citations57
US9076776B1Jul 7, 2015

Integrated circuit package with stand-off legs

LIM KEN BENG0 citations35

ALTERA CORP

2 patents
US9330997B1May 3, 2016

Heat spreading structures for integrated circuits

ALTERA CORP6 citations69
US9633874B1Apr 25, 2017

Package substrate warpage reshaping apparatus and method

ALTERA CORP5 citations67