P

Inventor

MCKEEVER ERIC J

US43 patents
⚠️ This page may combine multiple inventors who share the name “MCKEEVER ERIC J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

37 patents
US9913403B2Mar 6, 2018

Flexible coolant manifold—heat sink assembly

IBM20 citations94
US9453972B1Sep 27, 2016

Pluggable module for heat removal device

IBM27 citations94
US9009968B2Apr 21, 2015

Coolant manifold with separately rotatable manifold section(s)

IBM19 citations93
US9504184B2Nov 22, 2016

Flexible coolant manifold-heat sink assembly

IBM21 citations92
US9490188B2Nov 8, 2016

Compute intensive module packaging

IBM17 citations92
US9210831B2Dec 8, 2015

Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly

IBM17 citations92
US10111364B2Oct 23, 2018

Coupling assemblies for connecting fluid-carrying components

IBM5 citations84
US10024606B2Jul 17, 2018

Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

IBM6 citations84
US9726829B2Aug 8, 2017

Blind mating strain relieved optical fiber connector

IBM7 citations84
US9720184B2Aug 1, 2017

Blind mating strain relieved optical fiber connector

IBM7 citations84
US9494763B2Nov 15, 2016

Optical fiber routing mat

IBM6 citations84
US9497888B2Nov 15, 2016

Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)

IBM9 citations84
US9496194B2Nov 15, 2016

Customized module lid

IBM7 citations84
US9341418B2May 17, 2016

Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

IBM10 citations84
US9298231B2Mar 29, 2016

Methods of fabricating a coolant-cooled electronic assembly

IBM13 citations84
US9265178B2Feb 16, 2016

Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)

IBM6 citations84
US9265176B2Feb 16, 2016

Multi-component electronic module with integral coolant-cooling

IBM10 citations84
US9258925B2Feb 9, 2016

Selective clamping of electronics card to coolant-cooled structure

IBM10 citations83
US9144178B2Sep 22, 2015

Selective clamping of electronics card to coolant-cooled structure

IBM7 citations83
US9647762B2May 9, 2017

Integrated parallel optical transceiver

IBM8 citations82
US10422451B2Sep 24, 2019

Tapering couplers for connecting fluid flow components

IBM2 citations73
US10385996B2Aug 20, 2019

Tapering couplers for connecting fluid flow components

IBM5 citations73
US9818667B2Nov 14, 2017

Compute intensive module packaging

IBM3 citations73
US9661784B2May 23, 2017

Multi-component electronic module with integral coolant-cooling

IBM4 citations73
US9456527B2Sep 27, 2016

Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly

IBM4 citations73
US9253923B2Feb 2, 2016

Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)

IBM4 citations73
US9591787B2Mar 7, 2017

Selective clamping of electronics card to coolant-cooled structure

IBM3 citations72
US10104810B2Oct 16, 2018

Coupling assemblies for connecting fluid-carrying components

IBM1 citations63
US9265177B2Feb 16, 2016

Fabricating multi-component electronic module with integral coolant-cooling

IBM2 citations63
US11270919B2Mar 8, 2022

Customized module lid

IBM0 citations62
US10897835B2Jan 19, 2021

Coupling assemblies for connecting fluid-carrying components

IBM0 citations62
US10897834B2Jan 19, 2021

Coupling assemblies for connecting fluid-carrying components

IBM0 citations62
US9231387B2Jan 5, 2016

System for inserting and removing cables

IBM2 citations62
US10163742B2Dec 25, 2018

Customized module lid

IBM0 citations52
US9553429B2Jan 24, 2017

System for inserting and removing cables

IBM0 citations52
US9494762B2Nov 15, 2016

Optical fiber routing mat

IBM0 citations52
US9252574B2Feb 2, 2016

Method for inserting and removing cables

IBM0 citations52

BRODSKY WILLIAM L

4 patents

CAMPBELL LEVI A

1 patent

ATKINS ROBERT G

1 patent