Inventor
MCKEEVER ERIC J
US43 patents
⚠️ This page may combine multiple inventors who share the name “MCKEEVER ERIC J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
37 patentsUS9913403B2Mar 6, 2018
Flexible coolant manifold—heat sink assembly
IBM20 citations94
US9453972B1Sep 27, 2016
Pluggable module for heat removal device
IBM27 citations94
US9009968B2Apr 21, 2015
Coolant manifold with separately rotatable manifold section(s)
IBM19 citations93
US9504184B2Nov 22, 2016
Flexible coolant manifold-heat sink assembly
IBM21 citations92
US9490188B2Nov 8, 2016
Compute intensive module packaging
IBM17 citations92
US9210831B2Dec 8, 2015
Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
IBM17 citations92
US10111364B2Oct 23, 2018
Coupling assemblies for connecting fluid-carrying components
IBM5 citations84
US10024606B2Jul 17, 2018
Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
IBM6 citations84
US9726829B2Aug 8, 2017
Blind mating strain relieved optical fiber connector
IBM7 citations84
US9720184B2Aug 1, 2017
Blind mating strain relieved optical fiber connector
IBM7 citations84
US9494763B2Nov 15, 2016
Optical fiber routing mat
IBM6 citations84
US9497888B2Nov 15, 2016
Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)
IBM9 citations84
US9496194B2Nov 15, 2016
Customized module lid
IBM7 citations84
US9341418B2May 17, 2016
Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
IBM10 citations84
US9298231B2Mar 29, 2016
Methods of fabricating a coolant-cooled electronic assembly
IBM13 citations84
US9265178B2Feb 16, 2016
Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)
IBM6 citations84
US9265176B2Feb 16, 2016
Multi-component electronic module with integral coolant-cooling
IBM10 citations84
US9258925B2Feb 9, 2016
Selective clamping of electronics card to coolant-cooled structure
IBM10 citations83
US9144178B2Sep 22, 2015
Selective clamping of electronics card to coolant-cooled structure
IBM7 citations83
US9647762B2May 9, 2017
Integrated parallel optical transceiver
IBM8 citations82
US10422451B2Sep 24, 2019
Tapering couplers for connecting fluid flow components
IBM2 citations73
US10385996B2Aug 20, 2019
Tapering couplers for connecting fluid flow components
IBM5 citations73
US9818667B2Nov 14, 2017
Compute intensive module packaging
IBM3 citations73
US9661784B2May 23, 2017
Multi-component electronic module with integral coolant-cooling
IBM4 citations73
US9456527B2Sep 27, 2016
Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly
IBM4 citations73
US9253923B2Feb 2, 2016
Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)
IBM4 citations73
US9591787B2Mar 7, 2017
Selective clamping of electronics card to coolant-cooled structure
IBM3 citations72
US10104810B2Oct 16, 2018
Coupling assemblies for connecting fluid-carrying components
IBM1 citations63
US9265177B2Feb 16, 2016
Fabricating multi-component electronic module with integral coolant-cooling
IBM2 citations63
US11270919B2Mar 8, 2022
Customized module lid
IBM0 citations62
US10897835B2Jan 19, 2021
Coupling assemblies for connecting fluid-carrying components
IBM0 citations62
US10897834B2Jan 19, 2021
Coupling assemblies for connecting fluid-carrying components
IBM0 citations62
US9231387B2Jan 5, 2016
System for inserting and removing cables
IBM2 citations62
US10163742B2Dec 25, 2018
Customized module lid
IBM0 citations52
US9553429B2Jan 24, 2017
System for inserting and removing cables
IBM0 citations52
US9494762B2Nov 15, 2016
Optical fiber routing mat
IBM0 citations52
US9252574B2Feb 2, 2016
Method for inserting and removing cables
IBM0 citations52
BRODSKY WILLIAM L
4 patentsUS8589608B2Nov 19, 2013
Logic node connection system
BRODSKY WILLIAM L3 citations61
US8738828B2May 27, 2014
System to operationally connect logic nodes
BRODSKY WILLIAM L1 citations51
US8713228B2Apr 29, 2014
Shared system to operationally connect logic nodes
BRODSKY WILLIAM L0 citations51
US8597032B2Dec 3, 2013
Electronic assemblies mating system
BRODSKY WILLIAM L0 citations40