Inventor
LOO HOWE YIN
MY21 patents
⚠️ This page may combine multiple inventors who share the name “LOO HOWE YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
20 patentsUSD773452SDec 6, 2016
Electronic device with flexible hinge
INTEL CORP17 citations92
US11355427B2Jun 7, 2022
Device, method and system for providing recessed interconnect structures of a substrate
INTEL CORP14 citations85
US9360896B2Jun 7, 2016
Low-profile hinge for an electronic device
INTEL CORP8 citations84
USD756349SMay 17, 2016
Portable computing device with low profile hinge
INTEL CORP15 citations84
US10503211B2Dec 10, 2019
Multi-orientation display device
INTEL CORP10 citations83
US10394280B2Aug 27, 2019
Wearable electronic devices and components thereof
INTEL CORP6 citations83
US9904321B2Feb 27, 2018
Wearable electronic devices and components thereof
INTEL CORP6 citations83
US10041282B2Aug 7, 2018
Micro-hinge for an electronic device
INTEL CORP7 citations82
US10036187B2Jul 31, 2018
Micro-hinge for an electronic device
INTEL CORP7 citations82
US10633898B2Apr 28, 2020
Micro-hinge for an electronic device
INTEL CORP2 citations73
US10153253B2Dec 11, 2018
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
INTEL CORP2 citations73
US10085342B2Sep 25, 2018
Microelectronic device having an air core inductor
INTEL CORP6 citations73
US11006514B2May 11, 2021
Three-dimensional decoupling integration within hole in motherboard
INTEL CORP3 citations72
USD759029SJun 14, 2016
Computer on a stick
INTEL CORP3 citations64
US11639623B2May 2, 2023
Micro-hinge for an electronic device
INTEL CORP0 citations62
US10943792B2Mar 9, 2021
3D stacked-in-recess system in package
INTEL CORP1 citations62
US10643983B2May 5, 2020
Extended stiffener for platform miniaturization
INTEL CORP1 citations62
US12061502B2Aug 13, 2024
Expandable thermal solution for laptops
INTEL CORP1 citations57
US10083922B2Sep 25, 2018
Inductor interconnect
INTEL CORP1 citations52
US10136516B2Nov 20, 2018
Microelectronic device attachment on a reverse microelectronic package
INTEL CORP0 citations41