P

Inventor

LUAN ZHONGYU

CN34 patents

Patents

34 patents
US9826132B2Nov 21, 2017

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD14 citations92
US9906700B2Feb 27, 2018

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD6 citations84
US9781325B1Oct 3, 2017

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD5 citations84
US10578837B2Mar 3, 2020

Molded photosensitive assembly for array imaging module for electronic device

NINGBO SUNNY OPOTECH CO LTD1 citations73
US10321028B2Jun 11, 2019

Photosensitive assembly and camera module and manufacturing method thereof

NINGBO SUNNY OPOTECH CO LTD3 citations73
US11824071B2Nov 21, 2023

Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations63
US11289521B2Mar 29, 2022

Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device

NINGBO SUNNY OPOTECH CO LTD1 citations63
US10126519B2Nov 13, 2018

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD1 citations63
US12298533B2May 13, 2025

Manufacturing method of a molded photosensitive assembly for an array imaging module

NINGBO SUNNY OPOTECH CO LTD0 citations62
US12211864B2Jan 28, 2025

Camera module, and photosensitive assembly and manufacturing method therefor

NINGBO SUNNY OPOTECH CO LTD0 citations62
US12119361B2Oct 15, 2024

Circuit board assembly with photosensitive element mounted to back side of circuit board

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11822099B2Nov 21, 2023

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11729483B2Aug 15, 2023

Photosensitive component, and camera module and manufacturing method therefor

NINGBO SUNNY OPOTECH CO LTD1 citations62
US11721709B2Aug 8, 2023

Circuit board assembly with photosensitive element mounted to back side of circuit board

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11652132B2May 16, 2023

Systems and methods for manufacturing semiconductor modules

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11627239B2Apr 11, 2023

Photosensitive assembly and camera module and manufacturing method thereof

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11388320B2Jul 12, 2022

Photosensitive component, and camera module and manufacturing method therefor

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11233079B2Jan 25, 2022

Camera module and molded circuit board assembly thereof, array camera module and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations62
US11049898B2Jun 29, 2021

Systems and methods for manufacturing semiconductor modules

NINGBO SUNNY OPOTECH CO LTD1 citations62
US10908324B2Feb 2, 2021

Molded photosensitive assembly of array imaging module

NINGBO SUNNY OPOTECH CO LTD0 citations62
US12389524B2Aug 12, 2025

Molded circuit board and camera module, and manufacturing method thereof and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations61
US12364039B2Jul 15, 2025

Photosensitive assembly, camera module and manufacturing methods therefor

NINGBO SUNNY OPOTECH CO LTD0 citations61
US12081849B2Sep 3, 2024

Photosensitive assembly, camera module and manufacturing method thereof

NINGBO SUNNY OPOTECH CO LTD1 citations58
US12021097B2Jun 25, 2024

Camera module, and photosensitive component thereof and manufacturing method therefor

NINGBO SUNNY OPOTECH CO LTD0 citations52
US11223751B2Jan 11, 2022

Photosensitive assembly and camera module and manufacturing method thereof

NINGBO SUNNY OPOTECH CO LTD0 citations52
US10582097B2Mar 3, 2020

Photosensitive assembly and camera module and manufacturing method thereof

NINGBO SUNNY OPOTECH CO LTD0 citations52
US10274694B2Apr 30, 2019

Manufacturing method of a molded photosensitive assembly of an array imaging module

NINGBO SUNNY OPOTECH CO LTD0 citations52
US10175447B2Jan 8, 2019

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations52
US10033913B2Jul 24, 2018

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations52
US10979610B2Apr 13, 2021

Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations51
US11906879B2Feb 20, 2024

Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations50
US12408465B2Sep 2, 2025

Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly

NINGBO SUNNY OPOTECH CO LTD0 citations47
US11871100B2Jan 9, 2024

Camera module and blocking-type photosensitive assembly, manufacturing method thereof, and electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations46
US10148859B2Dec 4, 2018

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

NINGBO SUNNY OPOTECH CO LTD0 citations42